Latching Micro-D USB 3.0
Omnetics Quick Lock USB 3.0 form factor utilizes a 32% smaller panel area footprint, is 4X lighter, and can be directly soldered to a designers PCB.
Resources
| Title | Type | File |
| Quick Lock USB 3.0 Micro-D High-Speed Characterization | Download | |
| Quick Lock USB 3.0 Micro-D IP69 Qualification Test | Download | |
| Quick Lock USB 3.0 Micro-D Vibration and Mechanical Shock Test | Download | |
| USB 3.0 Quick Lock: Dimensions | Download |
Description
As we begin to tap into the potential of USB 3.0 speeds that run up to 5.0Gb/s, we find the technology offers many benefits when moving large quantities of information from one place to another: Cloud transfer, portable instrument downloads, and high-speed digital camera applications all benefit, and surveillance equipment, from still-frame to continuous-scanning, can now send a constant stream of high-quality images with ease. Once mated, this ruggedized high-speed connection is secure and waterproof to IP68 standards, and unlike ruggedized USB connectors packaged in the MILDTL-38999 circular standard, Omnetics Quick Lock USB 3.0 form factor utilizes a 32% smaller panel area footprint, is 4X lighter, and can be directly soldered to a designers PCB.
Quick Lock USB 3.0 connectors by Omnetics are sealed inside a rugged, battlefield tested and proven IP67 housing to ensure users achieve the highest levels of reliability while meeting USB 3.0 high-speed digital expectations (up to 5.0 Gb/s). These connectors use a halogen-free cable jacket for environmental sustainability and support high IR reflow temperatures up to 255°C while maintaining solder mount capability.
Additional information
| Omnetics Series | JUM |
|---|---|
| Connector 2 | USBF, USBF-RP, USBM, ZZZ, ZZZ-RP |
| Electrical Mechanical Specifications | – |
| Data Rate | Up to 5 Gbps |
| Impedance | 90±15 ? (connector); 90±7 ? (Cable) |
| Contact Resistance (Micro) | Pin 1 & 4: 30 m? (54mV) Max @ 1.8 Amps; Other Pins: 50 m? (12.5mv) Max @ 0.25 Amps |
| Current Rating | Pin 1 & 4: 1.8 Amps; Other Pins: 0.25 Amps |
| Dielectric Withstanding Voltage | 100 VAC (RMS) |
| Insulation Resistance | 100 M? (min) |
| EMI Shielding Effectiveness | Testing in Progress |
| Temperature Range | -40 °C to 85 °C |
| Durability | 500 Mating Cycles |
| Shock | 0 gs Monitored with No Discontinuity > 1 Microsecond IAW MIL-DTL-83513 and EIA 364-27 Condition E |
| Vibration | 20 gs Monitored with No Discontinuity > 1 Microsecond MIL-DTL-83513 and EIA 364-28 Condition IV |
| Sealing Performance | IP68 |
| Shell Options | – |
| Contact | Copper Alloy |
| Contact Finish | Gold Over Nickel Underplate |
| Insulator | High Temperature Thermoplastic Material UL 94V-0 |
| Housing | Aluminum 6061-T6 per SAE AMS-QQ-A-200/3 |
| Housing Plating & Finish | Black Nickel |
| Cable Jacket | Polyurethane (Black) |
| Overmold | Polyamide (Black) |
| Gasket | Silicone Rubber 50A |
| Hardware | Stainless Steel |
Features
As we begin to tap into the potential of USB 3.0 speeds that run up to 5.0Gb/s, we find the technology offers many benefits when moving large quantities of information from one place to another: Cloud transfer, portable instrument downloads, and high-speed digital camera applications all benefit, and surveillance equipment, from still-frame to continuous-scanning, can now send a constant stream of high-quality images with ease. Once mated, this ruggedized high-speed connection is secure and waterproof to IP68 standards, and unlike ruggedized USB connectors packaged in the MILDTL-38999 circular standard, Omnetics’ Quick Lock USB 3.0 form factor utilizes a 32% smaller panel area footprint, is 4X lighter, and can be directly soldered to a designer’s PCB.
Quick Lock USB 3.0 connectors by Omnetics are sealed inside a rugged, battlefield tested and proven IP67 housing to ensure users achieve the highest levels of reliability while meeting USB 3.0 high-speed digital expectations (up to 5.0 Gb/s). These connectors use a halogen-free cable jacket for environmental sustainability and support high IR reflow temperatures up to 255°C while maintaining solder mount capability.
Specifications
| Omnetics Series | JUM |
|---|---|
| Connector 2 | USBF, USBF-RP, USBM, ZZZ, ZZZ-RP |
| Electrical Mechanical Specifications | – |
| Data Rate | Up to 5 Gbps |
| Impedance | 90±15 ? (connector); 90±7 ? (Cable) |
| Contact Resistance (Micro) | Pin 1 & 4: 30 m? (54mV) Max @ 1.8 Amps; Other Pins: 50 m? (12.5mv) Max @ 0.25 Amps |
| Current Rating | Pin 1 & 4: 1.8 Amps; Other Pins: 0.25 Amps |
| Dielectric Withstanding Voltage | 100 VAC (RMS) |
| Insulation Resistance | 100 M? (min) |
| EMI Shielding Effectiveness | Testing in Progress |
| Temperature Range | -40 °C to 85 °C |
| Durability | 500 Mating Cycles |
| Shock | 0 gs Monitored with No Discontinuity > 1 Microsecond IAW MIL-DTL-83513 and EIA 364-27 Condition E |
| Vibration | 20 gs Monitored with No Discontinuity > 1 Microsecond MIL-DTL-83513 and EIA 364-28 Condition IV |
| Sealing Performance | IP68 |
| Shell Options | – |
| Contact | Copper Alloy |
| Contact Finish | Gold Over Nickel Underplate |
| Insulator | High Temperature Thermoplastic Material UL 94V-0 |
| Housing | Aluminum 6061-T6 per SAE AMS-QQ-A-200/3 |
| Housing Plating & Finish | Black Nickel |
| Cable Jacket | Polyurethane (Black) |
| Overmold | Polyamide (Black) |
| Gasket | Silicone Rubber 50A |
| Hardware | Stainless Steel |
