Omnetics Connector Corporation

Space Connectors

We have connector solutions for your next adventure to outer space and beyond. If you need a custom connector solution, please contact us. We build and engineer our connectors with pride in the USA.

Omnetics Connector Corporation has a rich history of supporting orbital and deep space projects. Our connectors have been used on traditional and commercial Space Shuttles, multiple Mars Rovers, the Hubble Telescope and countless Earth-Orbiting Satellites. For decades, our connectors have helped design engineers tasked with developing the next break-through in space history.

 

Omnetics’ New Connector Design and Materials Teams are centrally focused on low weight, high density and rugged superiority to meet the extreme reliability demands during launch through deep space operations. Special “rugged-mount” designs can be made to system configurations. Materials have been selected for thermal-expansion match to sustain continued performance from launch pad through geo-thermal orbit conditions. With increased densification of space cables and reduced connector size, Micro and Nano-scale interconnect systems offer significantly reduced weight and lower payload costs. Our design teams will also help with unique cable requirements to solve EMI, cross-talk and high speed problems. Backshells, strain-reliefs, braided shields and special cables are all available to improve handling and extend life in your system. Contact one of our Sales Representatives or reach out to Omnetics directly and we will help you optimize your design.

 

Omnetics offers multiple levels of space screening to the requirements of your specific application.


Space Level Screening
Ordering Steps:

  1. Step 1 – Choose a suitable Micro or Nano connector
  2. Step 2 – Choose a level of Space Screening
    1. Level 1 – Mission Critical (Highest Reliability)
    2. Level 2 – High Reliability
    3. Level 3 – Standard Reliability
  3. Step 3 – Select any added outgassing processing needed.
  4. Step 4 – Specify chosen ORDERING CODES from table below.
    These codes should be used as separate line items on
    all quote Requests and Purchase Orders as required.

Ordering Codes: (Quoted as seperate line items)

Screening Level Special Screening Only Processing for Outgassing

Level 1 - Mission Critical

SPT1

All standard materials exhibit less than 1.0% TML without additional processing. Contact service for special requirements.

Level 2 - High Reliability

SPT2

Level 3 - Standard Reliability

Standard

Micro (.050" Center)

Nano (.025" Center)

Sample Size (Allowable Failures)

Inspection/Test

Level 1
Com'l/SCD

Level 2
Com'l/SCD

Level 3
Com'l/SCD

Level 4
Com'l/SCD

Visual

100%

100%

100%

100%

Mechanical

2 (0)

2 (0)

2 (0)

2 (0)

Voltage Rating (DWV)

100%

2 (0)

100%

2 (0)

Insulation Resistance

2 (0)

2 (0)

100%

100%

Temperature Cycling

2 (0)

2 (0)

2 (0)

-

Low Level Contact Resistance

2 (0)

2 (0)

2 (0)

2 (0)

Mating/Unmating Force

2 (0)

-

2 (0)

-

Solderability/Resistance to heat
(SMT & Thru-Hole only)

2 (0)

-

2 (0)

-

Note: NASA screening requirements from Table 2C & 2J of EEE-INST-002
Nano – Rectangular Design @ .025” Pitch

Materials:

For up to +200°C operation*

Insulator:

2 Row-LCP / 30% glass,1 Row-PPS / 40% glass

Epoxy:

High Temperature

Pin count:

@ .025” pitch – up to 60 positions

Density:

Single row or 2 Row

Board Mounting:

SMT or Thru-Hole

Current Rating:

Up to 1 amp

Shock and Vibration:

Exceeds MIL-DTL-32139

High Shock Mounting & Mating Hardware
Micro – Rectangular Design @ .050” Pitch

Materials:

For up to +200°C operation*

Insulator:

PPS / 40% glass

Epoxy:

High Temperature

Pin count:

@ .050” pitch – up to 97 positions

Density:

Single row or 2 Row

Board Mounting:

SMT or Thru-Hole

Current Rating:

Up to 3 amp

Shock & Vibration:

Exceeds MIL-DTL-32139

High Shock Mounting & Mating Hardware

Metal Circular Connector Series

  • Outgassing meets NASA SP-R-0022
  • Threaded Coupling Mate - Unmate
  • EMI Cable Shield to Shell Design
  • Pin Count Micro - up to 27 positions
  • Pin Count Nano - up to 28 positions
  • O-ring Sealed
  • High-Flex Cable for rotating systems

New Connector Design & Materials are focused on low weight, high density and rugged superiority to meet the extreme reliability demands during launch through deep space operations. Special “rugged-mount” designs can be made to system configurations. Materials have been selected for thermal-expansion match to sustain continued performance from launch pad through geo-thermal orbit conditions. With increased densification of cable diameter and reduced connector size, nano-interconnect systems offer significantly reduced weight and lower payload costs. Our design team will also help with unique cable requirements to solve EMI, Cross-talk and High Speed problems. Backshells, Strain-reliefs, Braided shields and Special cables are all available to improve handling and extend life in your system.

* High Temperature Epoxy available upon request