Micro 360® Circulars Twist Lock Panel Mount – Straight Thru-Hole
$1.00
Omnetics micro series of circular connectors are now available with metal housings giving them a environmental seal.
Resources
| Title | Type | File |
| Micro 360® Circulars Twist Lock Panel Mount – Wired/Cable Contact | Download | |
| Micro 360® Circulars Twist Lock Panel Mount – Wired/Cable Ordering Guide | Download |
Description
Omnetics micro series of circular connectors are now available with metal housings giving them a environmental seal. They have ability to withstand high shock and vibrations while maintaining electrical integrity. A variety of shell material and finishes are available. Sizes available 5, 7, 12, 16, 27 & 39 .
Additional information
| Omnetics Series |
TMCP |
|---|---|
| Rows |
2 Rows ,3 Rows ,4 Rows |
| Termination Type |
DD – Thru-Hole Straight |
| Electrical Mechanical Specifications |
– |
| Temperature |
-55ºC to +125ºC (200 ºC w/HTE) |
| Dielectric Withstand Voltage |
250 VAC RMS at Sea Level |
| Contact Resistance |
26 Milliohm Max (65 mV Drop Max) @ 2.5 AMPs per MIL-DTL-83513 |
| Current Rating |
3 AMPs per contact |
| Durability |
500 cycles |
| Insulation Resistance |
5, 000 megohms min @ 500 VDC |
| Shock |
50 gs with no discontinuties > 1 microsecond |
| Vibration |
20 gs with no discontinuties > 1 microsecond |
| Thermal Vacuum Outgassing |
NASA SP-R-0022 |
| Mating/Unmating Force |
3 oz (85 g) typical per contact |
| Material Specifications |
– |
| Shell Material and Finish |
Ni Plated Brass or Black Ni. Contact Factory for other Materials |
| Insulator |
LCP per MIL-M-24519, Type GLCP-30F |
| Pin |
Beryllium Copper per ASTM B194, Alloy C17200 |
| Socket |
Copper Alloy MIL-DTL-83513 |
| Encapsulant |
Epoxy |
Features
Omnetics micro series of circular connectors are now available with metal housings giving them a environmental seal. They have ability to withstand high shock and vibrations while maintaining electrical integrity. A variety of shell material and finishes are available. Sizes available 5, 7, 12, 16, 27 & 39 .
Specifications
| Omnetics Series |
TMCP |
|---|---|
| Rows |
2 Rows ,3 Rows ,4 Rows |
| Termination Type |
DD – Thru-Hole Straight |
| Electrical Mechanical Specifications |
– |
| Temperature |
-55ºC to +125ºC (200 ºC w/HTE) |
| Dielectric Withstand Voltage |
250 VAC RMS at Sea Level |
| Contact Resistance |
26 Milliohm Max (65 mV Drop Max) @ 2.5 AMPs per MIL-DTL-83513 |
| Current Rating |
3 AMPs per contact |
| Durability |
500 cycles |
| Insulation Resistance |
5, 000 megohms min @ 500 VDC |
| Shock |
50 gs with no discontinuties > 1 microsecond |
| Vibration |
20 gs with no discontinuties > 1 microsecond |
| Thermal Vacuum Outgassing |
NASA SP-R-0022 |
| Mating/Unmating Force |
3 oz (85 g) typical per contact |
| Material Specifications |
– |
| Shell Material and Finish |
Ni Plated Brass or Black Ni. Contact Factory for other Materials |
| Insulator |
LCP per MIL-M-24519, Type GLCP-30F |
| Pin |
Beryllium Copper per ASTM B194, Alloy C17200 |
| Socket |
Copper Alloy MIL-DTL-83513 |
| Encapsulant |
Epoxy |
