Dual Row Offset Solder Cup (SS)

$1.00

The soldercup tails are commonly used for hand soldering applications, and or specific wire based devices that require a small robust connector during one of the final phases of production.

Resources

Title Type File
Dual Row Offset Solder Cup (SS) Contact PDF Download
Dual Row Offset Solder Cup (SS) Ordering Guide PDF Download
Compare

Description

The soldercup tails are commonly used for hand soldering applications, and or specific wire based devices that require a small robust connector during one of the final phases of production. Whatever your application, these connectors feature Omnetics’ gold plated Flex Pin contact system which meets the performance specifications of MIL-DTL-83513. These connectors are available with mounting holessuitable for PCB and flex mounting. These connectors are available in standard sizes ranging from 2 through 97 positions as well as custom configurations, and accept 26 AWG or smaller stranded wire.

Additional information

Omnetics SeriesPSM, SSO
Rows2 Rows
Termination TypeSS – Soldercup
Electrical Mechanical Specifications
Temperature-55ÂşC to +125ÂşC (200 ÂşC w/HTE)
Dielectric Withstand Voltage600 VAC RMS Sea Level
Contact Resistance26 milliohms (65 mV max @ 2.5 AMPs)
Current Rating3 AMPs per contact
Durability500 Cycles
Insulation Resistance5, 000 Megohms min @ 500 VDC
Shock50 gÂ’s with no discontinuities > 1 microsecond
Vibration20 gÂ’s with no discontinuities > 1 microsecond
Thermal Vacuum OutgassingNASA SP-R-0022
Mating/Unmating ForceForces not to exceed 6 oz/contact
Material Specifications
InsulatorPolyphenylene Sulfide per MIL-M-24519
SocketGold Plated Copper Alloy
EncapsulantEpoxy
Standard Pin PCB Tail TerminationSolder per J-STD-006 (Non-RoHS) or ASTM P-81728
RoHS Pin PCB Tail TerminationHard gold plate per ASTM B488
RoHS Socket PCB Tail TerminationHard gold plate per ASTM B488

Features

The soldercup tails are commonly used for hand soldering applications, and or specific wire based devices that require a small robust connector during one of the final phases of production. Whatever your application, these connectors feature Omnetics’ gold plated Flex Pin contact system which meets the performance specifications of MIL-DTL-83513. These connectors are available with mounting holessuitable for PCB and flex mounting. These connectors are available in standard sizes ranging from 2 through 97 positions as well as custom configurations, and accept 26 AWG or smaller stranded wire.

Specifications

Omnetics SeriesPSM, SSO
Rows2 Rows
Termination TypeSS – Soldercup
Electrical Mechanical Specifications
Temperature-55ÂşC to +125ÂşC (200 ÂşC w/HTE)
Dielectric Withstand Voltage600 VAC RMS Sea Level
Contact Resistance26 milliohms (65 mV max @ 2.5 AMPs)
Current Rating3 AMPs per contact
Durability500 Cycles
Insulation Resistance5, 000 Megohms min @ 500 VDC
Shock50 gÂ’s with no discontinuities > 1 microsecond
Vibration20 gÂ’s with no discontinuities > 1 microsecond
Thermal Vacuum OutgassingNASA SP-R-0022
Mating/Unmating ForceForces not to exceed 6 oz/contact
Material Specifications
InsulatorPolyphenylene Sulfide per MIL-M-24519
SocketGold Plated Copper Alloy
EncapsulantEpoxy
Standard Pin PCB Tail TerminationSolder per J-STD-006 (Non-RoHS) or ASTM P-81728
RoHS Pin PCB Tail TerminationHard gold plate per ASTM B488
RoHS Socket PCB Tail TerminationHard gold plate per ASTM B488

Resources

Title Type File
Dual Row Offset Solder Cup (SS) Contact PDF Download
Dual Row Offset Solder Cup (SS) Ordering Guide PDF Download

Accessories