Micro – Rectangular Design @ .050” Pitch
- Materials: For up to +200°C operation*
- Insulator: PPS / 40% glass,
Low Outgassing meets NASA SP-R0022
- Pin count: @ .050” pitch – up to 97 positions
- Density: Single row or 2 Row
- Board Mounting: SMT or Thru-Hole
- Current Rating: Up to 3 amp
- Shock & Vibration: Exceeds MIL-DTL-83513
- High Shock Mounting & Mating Hardware
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Applications Include
- Space Robotics
- Satellite Camera Electronics
- Satellite Phased Array Radar Systems
- Navigation and Transmission Circuitry
- Special Sensor Cable Systems
- EMI/Gamma Shields built to Specifications
- Special SMT Hardware for Substrate System
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New Connector Design & Materials are
focused on low weight, high density and rugged superiority
to meet the extreme reliability demands during launch through
deep space operations. Special “rugged-mount” designs can be
made to system configurations. Materials have been selected for
thermal-expansion match to sustain continued performance from
launch pad through geo-thermal orbit conditions. With increased
densification of cable diameter and reduced connector size, nano-interconnect
systems offer significantly reduced weight and lower payload
costs. Our design team will also help with unique cable
requirements to solve EMI, Cross-talk and High Speed problems.
Backshells, Strain-reliefs, Braided shields and Special cables
are all available to improve handling and extend life in your
system. Call our Sales Rep or Omnetics direct and we will work
with you to optimize your design.
* High
Temperature Epoxy available upon request |