Low Profile Micro-D Discrete Wired (WD)
$1.00
Low profile Micro-D micro-miniature connector series offers proven military spec performance and reliability with a reduced flange height and weight compared to standard Micro-D connectors. These connectors meet or exceed the performance requirement of MIL-DTL-83513 and are intended for high reliability board to wire I/O and wire-to-wire applications including high-temperature applications. The Low profile Micro-D connectors are available with 9 to 37 contacts and come with a variety of termination, hardware, and wiring options.
Resources
| Title | Type | File |
| Low Profile Micro-D Discrete Wired (WD)Contact | Download | |
| Low Profile Micro-D Discrete Wired (WD) Ordering Guide | Download | |
| Low Profile Micro-D Discrete Wired (WD) Hardware & Misc. | Download |
Description
Low profile Micro-D micro-miniature connector series offers proven military spec performance and reliability with a reduced flange height and weight compared to standard Micro-D connectors. These connectors meet or exceed the performance requirement of MIL-DTL-83513 and are intended for high reliability board to wire I/O and wire-to-wire applications including high-temperature applications. The Low profile Micro-D connectors are available with 9 to 37 contacts and come with a variety of termination, hardware, and wiring options.
Additional information
| Omnetics Series | MDLP, MDLS |
|---|---|
| Rows | 2 Rows |
| Termination Type | WD – Discrete Leadwire |
| Electrical Mechanical Specifications | – |
| Temperature | -55ºC to +125ºC (200 ºC w/HTE) |
| Dielectric Withstand Voltage | 600 VAC RMS Sea Level |
| Contact Resistance | 26 milliohms max (65 mV drop) @ 2.5 AMPS |
| Current Rating | 3 AMPS per contact |
| Durability | 2\,000 Mating Cycles min |
| Insulation Resistance | 5000 Meg ohms @ 500 VDC |
| Shock | 50 g’s with no discontinuities > 1 microsecond |
| Vibration | 20 g’s with no discontinuities > 1 microsecond |
| Thermal Vacuum Outgassing | 1.0% max TML\, 0.03% CVCM – NASA SP-R-0022 |
| Mating/Unmating Force | 3 oz (85 g) typical per contact |
| Material Specifications | – |
| Contact | Copper Alloy per MIL-DTL-83513 |
| Contact Finish | Gold per ASTM B488\, Type II\, Class 1.27\, Code C Over Nickel Underplate |
| Insulator | Thermoplastic per MIL-M-24519 |
| Interfacial Seal | Fluorosilicone Elastomer per A-A-59588 |
| Hardware | Stainless Steel\, 300 Series\, Passivated per SAE AMS-2700 |
| Shell Options | – |
| Aluminum Shell, Electroless Nickel Plated | Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221 Nickel per SAE AMS-2404 |
| Aluminum Shell, Cadmium Plated | Alloy 6061 per SAE AMS-QQ-A-200/8\, Cadmium with Yellow Chromate Conversion per SAE-AMS-QQ-P-416\, Type II\, Class 3 Over Nickel Underplate |
| Aluminum Shell, Black Anodized | Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221 Black Anodize per MIL-A-8625\, Type II\, Class 2 |
| Stainless Steel Shell, Passivated | 300 Series\, Passivated per SAE AMS-2700 |
Features
Low profile Micro-D micro-miniature connector series offers proven military spec performance and reliability with a reduced flange height and weight compared to standard Micro-D connectors. These connectors meet or exceed the performance requirement of MIL-DTL-83513 and are intended for high reliability board to wire I/O and wire-to-wire applications including high-temperature applications. The Low profile Micro-D connectors are available with 9 to 37 contacts and come with a variety of termination, hardware, and wiring options.
Specifications
| Omnetics Series | MDLP, MDLS |
|---|---|
| Rows | 2 Rows |
| Termination Type | WD – Discrete Leadwire |
| Electrical Mechanical Specifications | – |
| Temperature | -55ºC to +125ºC (200 ºC w/HTE) |
| Dielectric Withstand Voltage | 600 VAC RMS Sea Level |
| Contact Resistance | 26 milliohms max (65 mV drop) @ 2.5 AMPS |
| Current Rating | 3 AMPS per contact |
| Durability | 2\,000 Mating Cycles min |
| Insulation Resistance | 5000 Meg ohms @ 500 VDC |
| Shock | 50 g’s with no discontinuities > 1 microsecond |
| Vibration | 20 g’s with no discontinuities > 1 microsecond |
| Thermal Vacuum Outgassing | 1.0% max TML\, 0.03% CVCM – NASA SP-R-0022 |
| Mating/Unmating Force | 3 oz (85 g) typical per contact |
| Material Specifications | – |
| Contact | Copper Alloy per MIL-DTL-83513 |
| Contact Finish | Gold per ASTM B488\, Type II\, Class 1.27\, Code C Over Nickel Underplate |
| Insulator | Thermoplastic per MIL-M-24519 |
| Interfacial Seal | Fluorosilicone Elastomer per A-A-59588 |
| Hardware | Stainless Steel\, 300 Series\, Passivated per SAE AMS-2700 |
| Shell Options | – |
| Aluminum Shell, Electroless Nickel Plated | Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221 Nickel per SAE AMS-2404 |
| Aluminum Shell, Cadmium Plated | Alloy 6061 per SAE AMS-QQ-A-200/8\, Cadmium with Yellow Chromate Conversion per SAE-AMS-QQ-P-416\, Type II\, Class 3 Over Nickel Underplate |
| Aluminum Shell, Black Anodized | Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221 Black Anodize per MIL-A-8625\, Type II\, Class 2 |
| Stainless Steel Shell, Passivated | 300 Series\, Passivated per SAE AMS-2700 |
