Dual Row Solder Cup (SS)
$1.00
Horizontal SMT Micro Strip connectors offer an extremely low profile package that is well suited to pick and place methods.
Resources
Description
Horizontal SMT Micro Strip connectors offer an extremely low profile package that is well suited to pick and place methods. These connectors feature Omnetics’ highly reliable gold plated Flex Pin contact system conforming to the requirements of MIL-DTL-83513. These rugged light weight connectors are suitable for the most demanding applications. Available with mounting holes suitable for PCB and flex mounting. These connectors are available in standard sizes ranging from 2 through 64 positions as well as custom configurations.
Additional information
| Omnetics Series | DRP, DRS |
|---|---|
| Rows | 2 Rows |
| Termination Type | SS – Soldercup |
| Electrical Mechanical Specifications | – |
| Temperature | -55ÂşC to +125ÂşC (200 ÂşC w/HTE) |
| Dielectric Withstand Voltage | 600 VAC RMS Sea Level |
| Contact Resistance | 26 milliohms (65 mV max @ 2.5 AMPs) |
| Current Rating | 3 AMPs per contact |
| Durability | 500 Cycles |
| Insulation Resistance | 5, 000 Megohms min @ 500 VDC |
| Shock | 50 gÂ’s with no discontinuities > 1 microsecond |
| Vibration | 20 gÂ’s with no discontinuities > 1 microsecond |
| Thermal Vacuum Outgassing | NASA SP-R-0022 |
| Mating/Unmating Force | Forces not to exceed 6 oz/contact |
| Material Specifications | – |
| Insulator | Polyphenylene Sulfide per MIL-M-24519 |
| Socket | Gold Plated Copper Alloy |
| Encapsulant | Epoxy |
| Standard Pin PCB Tail Termination | Solder per J-STD-006 (Non-RoHS) or ASTM P-81728 |
| RoHS Pin PCB Tail Termination | Hard gold plate per ASTM B488 |
| RoHS Socket PCB Tail Termination | Hard gold plate per ASTM B488 |
Features
Specifications
| Omnetics Series | DRP, DRS |
|---|---|
| Rows | 2 Rows |
| Termination Type | SS – Soldercup |
| Electrical Mechanical Specifications | – |
| Temperature | -55ÂşC to +125ÂşC (200 ÂşC w/HTE) |
| Dielectric Withstand Voltage | 600 VAC RMS Sea Level |
| Contact Resistance | 26 milliohms (65 mV max @ 2.5 AMPs) |
| Current Rating | 3 AMPs per contact |
| Durability | 500 Cycles |
| Insulation Resistance | 5, 000 Megohms min @ 500 VDC |
| Shock | 50 gÂ’s with no discontinuities > 1 microsecond |
| Vibration | 20 gÂ’s with no discontinuities > 1 microsecond |
| Thermal Vacuum Outgassing | NASA SP-R-0022 |
| Mating/Unmating Force | Forces not to exceed 6 oz/contact |
| Material Specifications | – |
| Insulator | Polyphenylene Sulfide per MIL-M-24519 |
| Socket | Gold Plated Copper Alloy |
| Encapsulant | Epoxy |
| Standard Pin PCB Tail Termination | Solder per J-STD-006 (Non-RoHS) or ASTM P-81728 |
| RoHS Pin PCB Tail Termination | Hard gold plate per ASTM B488 |
| RoHS Socket PCB Tail Termination | Hard gold plate per ASTM B488 |
