Description

The High-Speed Nano-D uses modified insulators and pin arrangements to optimize impedance and performance for high-speed or high-density signal routing.

High-Speed connectors and cables are optimized for gigabit digital applications and protocols such as: USB 3.0, 10GbE, Camera Link, and PCIe. These high performance Mil-Aero style Nano-D connectors are built using Omnetics MIL-DTL-32139 compliant Flex Pin contact solution. The High-Speed connector solutions have the ability to withstand high shock and vibration while maintaining signal integrity:

Additional information

Omnetics SeriesMNSO
Electrical Mechanical SpecificationsDurability > 2000 Mating Cycles min Temperature -55ºC to +125 ºC Current rating 1 Amp per contact Voltage Rating (DWV) 250 VAC RMS Sea Level Insulation Resistance 5,000 Megohms @ 100 VDC Shock 100 g’s discontinuity < 10 nanoseconds Vibration 20 g’s discontinuity < 10 nanoseconds Thermal Vacuum Outgassing 1.0% max TML, 0.1% VCM Contact Resistance 71 milliohms (71 mV) max @ 1 Amp Mating/Unmating Force 2.5 oz. (.71g) typical per contact
Material SpecificationsContact Copper Alloy Per MIL-DTL-32139 Contact Finish Gold per ASTM B488, Type II, Class 1.27, Code C Over Nickel Underplate Insulator LCP Per MIL-DTL-32139 Encapsulant Epoxy
Shell OptionsAluminum 6061 Electroless Nickel per SAE-AMS-2404 Stainless Steel, 300 Series Passivated per SAE-AMS-2700
High-Speed SpecificationsData Rate Up to 12.6 Gbps

Features

  • Pinout options designed for higher density and higher speed
  • Turnkey pre-wired factory cables and PCB connector solutions.
  • Unique contact isolation and spacing for optimal performance up to 20 Gbps.
  • 30 AWG parallel pair High-Speed cable.
  • 1 Amp Flex Pin contacts performance in high vibrations and shock environments.

Specifications

Resources

Title Type File
A29861-001 PDF PDF Download
A29861-001 3D Model ZIP (STEP file) Download