A29861-001
Single Row Bi-Lobe® nano harnesses are available with 30 AWG and smaller stranded wire. These multi connector assemblies are crimped using proprietary semi-automated crimping systems.
Description
The High-Speed Nano-D uses modified insulators and pin arrangements to optimize impedance and performance for high-speed or high-density signal routing.
High-Speed connectors and cables are optimized for gigabit digital applications and protocols such as: USB 3.0, 10GbE, Camera Link, and PCIe. These high performance Mil-Aero style Nano-D connectors are built using Omnetics MIL-DTL-32139 compliant Flex Pin contact solution. The High-Speed connector solutions have the ability to withstand high shock and vibration while maintaining signal integrity.
Additional information
| Omnetics Series | JUM |
|---|---|
| Rows | 1 Row |
| Connector 1 | MBPS, MBSS |
| Temperature | -55ºC to +125ºC |
| Dielectric Withstand Voltage | 250 VAC RMS Sea Level |
| Contact Resistance | 71 milliohms (71mV) max @ 1 AMP |
| Current Rating | 1 AMP per contact |
| Durability | >2000 Mating cycles min |
| Insulation Resistance | 5000 megohms @ 100 VDC |
| Shock | 100 g’s discontinuty < 10 nanoseconds |
| Vibration | 20 g’s discontinuties < 10 nanoseconds |
| Thermal Vacuum Outgassing | 1.0% max TML, 0.1% max VCM |
| Mating/Unmating Force | 2.5 oz (.71g) typical per contact |
| Material Specifications | – |
| Shell Material and Finish | Aluminum Shell, Electroless Nickel Plated Aluminum Shell, Black AnodizedAluminum Shell, Cadmium PlatedTitanium Shell, UnplatedStainless Steel Shell, Passivated |
| Insulator | Liquid Crystal Polymer per MIL-DTL-32139 or PEEK |
| Pin | Gold Plated BeCu |
| Socket | Gold Plated Copper Alloy |
| Encapsulant | Epoxy |
| High-Speed | Up to 12.6Gbps |
Features
Two pinout options : High Density (HS2) and High Performance (HS3).
Turnkey pre-wired factory cables and PCB connector solutions.
Unique contact isolation and spacing for optimal performance up to 20 Gbps.
30 AWG parallel pair high-speed cable.
1 Amp Flex Pin contacts performance in high vibrations and shock environments.
Specifications
| Omnetics Series | JUM |
|---|---|
| Rows | 1 Row |
| Connector 1 | MBPS, MBSS |
| Temperature | -55ºC to +125ºC |
| Dielectric Withstand Voltage | 250 VAC RMS Sea Level |
| Contact Resistance | 71 milliohms (71mV) max @ 1 AMP |
| Current Rating | 1 AMP per contact |
| Durability | >2000 Mating cycles min |
| Insulation Resistance | 5000 megohms @ 100 VDC |
| Shock | 100 g’s discontinuty < 10 nanoseconds |
| Vibration | 20 g’s discontinuties < 10 nanoseconds |
| Thermal Vacuum Outgassing | 1.0% max TML, 0.1% max VCM |
| Mating/Unmating Force | 2.5 oz (.71g) typical per contact |
| Material Specifications | – |
| Shell Material and Finish | Aluminum Shell, Electroless Nickel Plated Aluminum Shell, Black AnodizedAluminum Shell, Cadmium PlatedTitanium Shell, UnplatedStainless Steel Shell, Passivated |
| Insulator | Liquid Crystal Polymer per MIL-DTL-32139 or PEEK |
| Pin | Gold Plated BeCu |
| Socket | Gold Plated Copper Alloy |
| Encapsulant | Epoxy |
| High-Speed | Up to 12.6Gbps |
