Nano-D / Bi-Lobe® Connectors – Single Row Vertical SMT (VV)
$1.00
Vertical SMT Bi-Lobe® nanos require a minimal amount of board space on flex circuits and rigid circuit boards. These connectors feature Omnetics highly reliable gold plated Flex Pin contact system conforming to the requirements of MIL-DTL-32139.
Resources
| Title | Type | File |
| Nano-D / Bi-Lobe® Connectors – Single Row Vertical SMT (VV) Contact | Download | |
| Nano-D / Bi-Lobe® Connectors – Single Row Vertical SMT (VV) Ordering Guide | Download | |
| Nano-D / Bi-Lobe® Connectors – Single Row Vertical SMT (VV) Hardware & Misc. | Download |
Description
Vertical SMT Bi-Lobe® nanos require a minimal amount of board space on flex circuits and rigid circuit boards. These connectors feature Omnetics highly reliable gold plated Flex Pin contact system conforming to the requirements of MIL-DTL-32139.
Set on a .025″ (.64 mm) pitch, these rugged lightweight connectors are suitable for the most demanding applications. They are available with threaded mounting holes and retention screws.
Shell material choices include Aluminum and Stainless steel with multiple standard and custom plating options upon request. These connectors are available in standard sizes ranging from 5 through 51 positions, as well as custom configurations.
Additional information
| Omnetics Series | MBPS, MBSS |
|---|---|
| Rows | 1 Row |
| Termination Type | VV – Vertical Surface Mount |
| Electrical Mechanical Specifications | – |
| Temperature | -55ºC to +125ºC (200 ºC w/HTE) |
| Dielectric Withstand Voltage | 250 VAC RMS Sea Level |
| Contact Resistance | 71 mV Drop @ 1 AMP |
| Current Rating | 1 AMP per contact |
| Durability | 200 Mating cycles min* |
| Insulation Resistance | 5000 megohms min @ 100 VDC |
| Shock | 100 gs with no discontinuties > 10 nanoseconds |
| Vibration | 20 gs with no discontinuties > 10 nanoseconds |
| Thermal Vacuum Outgassing | 1.0% max TML, 0.1% max VCM |
| Mating/Unmating Force | 7 oz. (198 g) max per contact |
| Material Specifications | – |
| Shell Material and Finish | Aluminum Shell, Electroless Nickel Plated Aluminum Shell, Black AnodizedAluminum Shell, Cadmium PlatedTitanium Shell, UnplatedStainless Steel Shell, Passivated |
| Insulator | Liquid Crystal Polymer per MIL-DTL-32139 or PEEK |
| Pin | Gold Plated BeCu |
| Socket | Gold Plated Copper Alloy |
| Encapsulant | Epoxy |
Features
Vertical SMT Bi-Lobe® nanos require a minimal amount of board space on flex circuits and rigid circuit boards. These connectors feature Omnetics highly reliable gold plated Flex Pin contact system conforming to the requirements of MIL-DTL-32139.
Set on a .025″ (.64 mm) pitch, these rugged lightweight connectors are suitable for the most demanding applications. They are available with threaded mounting holes and retention screws.
Shell material choices include Aluminum and Stainless steel with multiple standard and custom plating options upon request. These connectors are available in standard sizes ranging from 5 through 51 positions, as well as custom configurations.
Specifications
| Omnetics Series | MBPS, MBSS |
|---|---|
| Rows | 1 Row |
| Termination Type | VV – Vertical Surface Mount |
| Electrical Mechanical Specifications | – |
| Temperature | -55ºC to +125ºC (200 ºC w/HTE) |
| Dielectric Withstand Voltage | 250 VAC RMS Sea Level |
| Contact Resistance | 71 mV Drop @ 1 AMP |
| Current Rating | 1 AMP per contact |
| Durability | 200 Mating cycles min* |
| Insulation Resistance | 5000 megohms min @ 100 VDC |
| Shock | 100 gs with no discontinuties > 10 nanoseconds |
| Vibration | 20 gs with no discontinuties > 10 nanoseconds |
| Thermal Vacuum Outgassing | 1.0% max TML, 0.1% max VCM |
| Mating/Unmating Force | 7 oz. (198 g) max per contact |
| Material Specifications | – |
| Shell Material and Finish | Aluminum Shell, Electroless Nickel Plated Aluminum Shell, Black AnodizedAluminum Shell, Cadmium PlatedTitanium Shell, UnplatedStainless Steel Shell, Passivated |
| Insulator | Liquid Crystal Polymer per MIL-DTL-32139 or PEEK |
| Pin | Gold Plated BeCu |
| Socket | Gold Plated Copper Alloy |
| Encapsulant | Epoxy |
