Nano-D / Bi-Lobe® Connectors – Dual Row – Jumpers (JU)
$1.00
Jumpers Dual Row Bi-Lobe® Nano-D’s are available with 30 AWG and smaller stranded wire.
Resources
| Title | Type | File |
| Nano-D / Bi-Lobe® Connectors – Dual Row – Jumpers (JU) Contact | Download | |
| Nano-D / Bi-Lobe® Connectors – Dual Row – Jumpers (JU) Ordering Guide | Download | |
| Nano-D / Bi-Lobe® Connectors – Dual Row – Jumpers (JU) Hardware & Misc. | Download |
Description
Jumpers Dual Row Bi-Lobe® Nano-D’s are available with 30 AWG and smaller stranded wire. These assemblies are crimped using proprietary semi-automated crimping systems. Due to their small size and precision required to make these quality crimps, hand crimping is not an option. Precrimped wires and contacts are potted in place further protecting the integrity of the crimp joint.
Building these parts to order allows for maximum flexibility in wire type, size and color coding. Commercial off the shelf (COTS) versions are also available with 18 of color coded 30 AWG Teflon for quick turn around.
These connectors are available in standard sizes ranging from 9 through 65 positions, as well as custom configurations. Full QPL versions of MIL-DTL -32139 are also available from Omnetics.
Additional information
| Omnetics Series | MNPO, MNSO |
|---|---|
| Rows | 2 Rows |
| Connector 1 | MBPS, MBSS |
| Electrical Mechanical Specifications | – |
| Temperature | -55ºC to +125ºC (200 ºC w/HTE) |
| Dielectric Withstand Voltage | 250 VAC RMS Sea Level |
| Contact Resistance | 71 mV Drop @ 1 AMP |
| Current Rating | 1 AMP per contact |
| Durability | 200 Mating cycles min* |
| Insulation Resistance | 5000 megohms min @ 100 VDC |
| Shock | 100 gs with no discontinuties > 10 nanoseconds |
| Vibration | 20 gs with no discontinuties > 10 nanoseconds |
| Thermal Vacuum Outgassing | 1.0% max TML, 0.1% max VCM |
| Mating/Unmating Force | 7 oz. (198 g) max per contact |
| Material Specifications | – |
| Shell Material and Finish | Aluminum Shell, Electroless Nickel Plated Aluminum Shell, Black AnodizedAluminum Shell, Cadmium PlatedTitanium Shell, UnplatedStainless Steel Shell, Passivated |
| Insulator | Liquid Crystal Polymer per MIL-DTL-32139 or PEEK |
| Pin | Gold Plated BeCu |
| Socket | Gold Plated Copper Alloy |
| Encapsulant | Epoxy |
Features
Jumpers Dual Row Bi-Lobe® Nano-D’s are available with 30 AWG and smaller stranded wire. These assemblies are crimped using proprietary semi-automated crimping systems. Due to their small size and precision required to make these quality crimps, hand crimping is not an option. Precrimped wires and contacts are potted in place further protecting the integrity of the crimp joint.
Building these parts to order allows for maximum flexibility in wire type, size and color coding. Commercial off the shelf (COTS) versions are also available with 18” of color coded 30 AWG Teflon for quick turn around.
These connectors are available in standard sizes ranging from 9 through 65 positions, as well as custom configurations. Full QPL versions of MIL-DTL -32139 are also available from Omnetics.
Specifications
| Omnetics Series | MNPO, MNSO |
|---|---|
| Rows | 2 Rows |
| Connector 1 | MBPS, MBSS |
| Electrical Mechanical Specifications | – |
| Temperature | -55ºC to +125ºC (200 ºC w/HTE) |
| Dielectric Withstand Voltage | 250 VAC RMS Sea Level |
| Contact Resistance | 71 mV Drop @ 1 AMP |
| Current Rating | 1 AMP per contact |
| Durability | 200 Mating cycles min* |
| Insulation Resistance | 5000 megohms min @ 100 VDC |
| Shock | 100 gs with no discontinuties > 10 nanoseconds |
| Vibration | 20 gs with no discontinuties > 10 nanoseconds |
| Thermal Vacuum Outgassing | 1.0% max TML, 0.1% max VCM |
| Mating/Unmating Force | 7 oz. (198 g) max per contact |
| Material Specifications | – |
| Shell Material and Finish | Aluminum Shell, Electroless Nickel Plated Aluminum Shell, Black AnodizedAluminum Shell, Cadmium PlatedTitanium Shell, UnplatedStainless Steel Shell, Passivated |
| Insulator | Liquid Crystal Polymer per MIL-DTL-32139 or PEEK |
| Pin | Gold Plated BeCu |
| Socket | Gold Plated Copper Alloy |
| Encapsulant | Epoxy |
