Dual Row Offset Horizontal SMT (AA)

Horizontal SMT Micro Strip connectors offer an extremely low profile package that is well suited to pick and place methods. These connectors feature Omnetics' highly reliable gold plated Flex Pin contact system which meets the performance specifications of MIL-DTL-83513. These rugged light weight connectors are suitable for the most demanding applications. Available with mounting holes suitable for PCB and flex mounting. These connectors are available in standard sizes ranging from 2 through 97 positions as well as custom configurations.

Electrical Mechanical Specifications
Temperature:	-55ºC to 125ºC (200ºC with HTE)
Durability:	500 Cycles
Insulation Resistance:	5,000 Megohms min @ 500 VDC
Voltage Rating (DWV)	600 VAC RMS Sea Level
Shock:	50 G’s discontinuity < 1 microsecond
Vibration:	20 G’s discontinuity < 1 microsecond
Thermal Vacuum Outgassing	NASA SP-R-0022
Contact Resistance:	26 milliohms (65 mV max @ 2.5 amp)
Current Rating:	3 amp per contact
Mating/Unmating Force:	Forces not to exceed 6 oz/contact
Material Specifications
Insulator	Polyphenylene Sulfide per MIL-M-24519
Socket	Gold Plated Copper Alloy
Encapsulant	Epoxy
Standard Pin PCB Tail Termination:	Solder per J-STD-006 (Non-RoHS)
RoHS Pin PCB Tail Termination:	Hard gold plate per ASTM B488
RoHS Socket PCB Tail Termination:	Hard gold plate per ASTM B488

Tested to and passed the following performance specifications of MIL-DTL-83513

Current Rating:	3 amps max
Dielectric Withstanding Voltage	600 VAC RMS
Insulation Resistance:	5000 megohms @ 500 VDC
Contact Resistance	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating Force	Forces not to exceed 10 oz/contact
Temperature Cycling	-55ºC to 125ºC, 5 Cycles
Humidity Mated	IAW EIA-364-31, Method IV, Omit Steps 7A & 7B
Vibration	IAW EIA-364-28, Condition IV
Mechanical Shock:	IAW EIA-364-27, Condition E
Durability	500 cycles
Contact Resistance after Durability	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating after Durability:	Forces not to exceed 6 oz/contact
Salt Spray:	48 hrs IAW-MIL-STD-1344, Method 1001.1, Test Condition B
Low Level Contact Resistance after Salt Spray:	28 milliohms max (2.8 mv) max @ 100 milliamps
Contact Resistance after Salt Spray:	28 milliohms (70 mv) max @ 2.5 amps
Mating/Unmating force after Salt Spray:	Forces not to exceed 6 oz/contact
Contact Retention after Salt Spray:	Minimum of 5 lbs contact retention
Thermal Vacuum Out gassing:	NASA SP-R-0022
Solder Heat & Contact	360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention:	5 lbs retention force
Solder ability:	MIL-STD-202, Method 208

* Currently Qualified To MIL-DTL-83513 01/02/03/04 Specifications
* Forces as measured using minimum and maximum diameter test sleeves

Dual Row Offset Straight Tail (DD)

The Dual Row .050” Offset Micro Strip connectors are configured with simple straight tails (Integral or Crimped). Suitable for vertical thru-hole mounting to fine pitched or rigid flex circuits. The straight solid tails are also commonly used in ultra fine wrap terminations, such as electro physiology. These connectors feature Omnetics' highly reliable gold plated Flex Pin contact system which meets the performance specifications of MIL-DTL-83513. Available with mounting holes suitable for PCB and flex mounting. These connectors are available in standard sizes ranging from 2 through 97 positions as well as custom configurations. Flex design and installation service is also available from Omnetics. Please contact us for more information.

Electrical Mechanical Specifications
Temperature:	-55ºC to 125ºC (200ºC with HTE)
Durability:	500 Cycles
Insulation Resistance:	5,000 Megohms min @ 500 VDC
Voltage Rating (DWV)	600 VAC RMS Sea Level
Shock:	50 G’s discontinuity < 1 microsecond
Vibration:	20 G’s discontinuity < 1 microsecond
Thermal Vacuum Outgassing	NASA SP-R-0022
Contact Resistance:	26 milliohms (65 mV max @ 2.5 amp)
Current Rating:	3 amp per contact
Mating/Unmating Force:	Forces not to exceed 6 oz/contact
Material Specifications
Insulator	Polyphenylene Sulfide per MIL-M-24519
Socket	Gold Plated Copper Alloy
Encapsulant	Epoxy
Standard Pin PCB Tail Termination:	Solder per J-STD-006 (Non-RoHS)
RoHS Pin PCB Tail Termination:	Hard gold plate per ASTM B488
RoHS Socket PCB Tail Termination:	Hard gold plate per ASTM B488

Tested to and passed the following performance specifications of MIL-DTL-83513

Current Rating:	3 amps max
Dielectric Withstanding Voltage	600 VAC RMS
Insulation Resistance:	5000 megohms @ 500 VDC
Contact Resistance	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating Force	Forces not to exceed 10 oz/contact
Temperature Cycling	-55ºC to 125ºC, 5 Cycles
Humidity Mated	IAW EIA-364-31, Method IV, Omit Steps 7A & 7B
Vibration	IAW EIA-364-28, Condition IV
Mechanical Shock:	IAW EIA-364-27, Condition E
Durability	500 cycles
Contact Resistance after Durability	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating after Durability:	Forces not to exceed 6 oz/contact
Salt Spray:	48 hrs IAW-MIL-STD-1344, Method 1001.1, Test Condition B
Low Level Contact Resistance after Salt Spray:	28 milliohms max (2.8 mv) max @ 100 milliamps
Contact Resistance after Salt Spray:	28 milliohms (70 mv) max @ 2.5 amps
Mating/Unmating force after Salt Spray:	Forces not to exceed 6 oz/contact
Contact Retention after Salt Spray:	Minimum of 5 lbs contact retention
Thermal Vacuum Out gassing:	NASA SP-R-0022
Solder Heat & Contact	360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention:	5 lbs retention force
Solder ability:	MIL-STD-202, Method 208

* Currently Qualified To MIL-DTL-83513 01/02/03/04 Specifications
* Forces as measured using minimum and maximum diameter test sleeves

Dual Row Offset Flex Tail (FF)

Flex mount offset Micro Strip connectors are a low profile ruggedized connector on .050” (1.27 mm) centerlines. The SMTtails are formed together in an hourglass shape, allowing a double sided flex circuit to slide between the 2 rows of leads. The spring tension holds the flex in place during the soldering process. These durable light weight connectors are suitable for the most demanding applications. They are available with mounting holes suitable for PCB and flex mounting, and feature Omnetics' highly reliable gold plated Flex Pin contact system which meets the performance specifications of MIL-DTL-83513. These connectors are available in standard sizes ranging from 2 through 97 positions as well as custom configurations. Flex design and installation service is also available from Omnetics. Please contact us for more information.

Electrical Mechanical Specifications
Temperature:	-55ºC to 125ºC (200ºC with HTE)
Durability:	500 Cycles
Insulation Resistance:	5,000 Megohms min @ 500 VDC
Voltage Rating (DWV)	600 VAC RMS Sea Level
Shock:	50 G’s discontinuity < 1 microsecond
Vibration:	20 G’s discontinuity < 1 microsecond
Thermal Vacuum Outgassing	NASA SP-R-0022
Contact Resistance:	26 milliohms (65 mV max @ 2.5 amp)
Current Rating:	3 amp per contact
Mating/Unmating Force:	Forces not to exceed 6 oz/contact
Material Specifications
Insulator	Polyphenylene Sulfide per MIL-M-24519
Socket	Gold Plated Copper Alloy
Encapsulant	Epoxy
Standard Pin PCB Tail Termination:	Solder per J-STD-006 (Non-RoHS)
RoHS Pin PCB Tail Termination:	Hard gold plate per ASTM B488
RoHS Socket PCB Tail Termination:	Hard gold plate per ASTM B488

Tested to and passed the following performance specifications of MIL-DTL-83513

Current Rating:	3 amps max
Dielectric Withstanding Voltage	600 VAC RMS
Insulation Resistance:	5000 megohms @ 500 VDC
Contact Resistance	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating Force	Forces not to exceed 10 oz/contact
Temperature Cycling	-55ºC to 125ºC, 5 Cycles
Humidity Mated	IAW EIA-364-31, Method IV, Omit Steps 7A & 7B
Vibration	IAW EIA-364-28, Condition IV
Mechanical Shock:	IAW EIA-364-27, Condition E
Durability	500 cycles
Contact Resistance after Durability	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating after Durability:	Forces not to exceed 6 oz/contact
Salt Spray:	48 hrs IAW-MIL-STD-1344, Method 1001.1, Test Condition B
Low Level Contact Resistance after Salt Spray:	28 milliohms max (2.8 mv) max @ 100 milliamps
Contact Resistance after Salt Spray:	28 milliohms (70 mv) max @ 2.5 amps
Mating/Unmating force after Salt Spray:	Forces not to exceed 6 oz/contact
Contact Retention after Salt Spray:	Minimum of 5 lbs contact retention
Thermal Vacuum Out gassing:	NASA SP-R-0022
Solder Heat & Contact	360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention:	5 lbs retention force
Solder ability:	MIL-STD-202, Method 208

* Currently Qualified To MIL-DTL-83513 01/02/03/04 Specifications
* Forces as measured using minimum and maximum diameter test sleeves

Horizontal Thru-Hole - Type H2

The Dual Row Offset Micro Strip connectors H2 have contacts arranged on .050” (1.27 mm) centerlines. The thru-hole tails are spread out into a mounting pattern on .050 (1.27 mm) centers, allowing space for traces and annular rings. These connectors feature Omnetics' highly reliable gold plated Flex Pin contact system which meets the performance specifications of MIL-DTL-83513. These durable light weight connectors are suitable for the most demanding applications. Available with mounting holes suitable for PCB and flex mounting. These connectors are available in standard sizes ranging from 2 through 97 positions as well as custom configurations.

Electrical Mechanical Specifications
Temperature:	-55ºC to 125ºC (200ºC with HTE)
Durability:	500 Cycles
Insulation Resistance:	5,000 Megohms min @ 500 VDC
Voltage Rating (DWV)	600 VAC RMS Sea Level
Shock:	50 G’s discontinuity < 1 microsecond
Vibration:	20 G’s discontinuity < 1 microsecond
Thermal Vacuum Outgassing	NASA SP-R-0022
Contact Resistance:	26 milliohms (65 mV max @ 2.5 amp)
Current Rating:	3 amp per contact
Mating/Unmating Force:	Forces not to exceed 6 oz/contact
Material Specifications
Insulator	Polyphenylene Sulfide per MIL-M-24519
Socket	Gold Plated Copper Alloy
Encapsulant	Epoxy
Standard Pin PCB Tail Termination:	Solder per J-STD-006 (Non-RoHS)
RoHS Pin PCB Tail Termination:	Hard gold plate per ASTM B488
RoHS Socket PCB Tail Termination:	Hard gold plate per ASTM B488

Tested to and passed the following performance specifications of MIL-DTL-83513

Current Rating:	3 amps max
Dielectric Withstanding Voltage	600 VAC RMS
Insulation Resistance:	5000 megohms @ 500 VDC
Contact Resistance	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating Force	Forces not to exceed 10 oz/contact
Temperature Cycling	-55ºC to 125ºC, 5 Cycles
Humidity Mated	IAW EIA-364-31, Method IV, Omit Steps 7A & 7B
Vibration	IAW EIA-364-28, Condition IV
Mechanical Shock:	IAW EIA-364-27, Condition E
Durability	500 cycles
Contact Resistance after Durability	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating after Durability:	Forces not to exceed 6 oz/contact
Salt Spray:	48 hrs IAW-MIL-STD-1344, Method 1001.1, Test Condition B
Low Level Contact Resistance after Salt Spray:	28 milliohms max (2.8 mv) max @ 100 milliamps
Contact Resistance after Salt Spray:	28 milliohms (70 mv) max @ 2.5 amps
Mating/Unmating force after Salt Spray:	Forces not to exceed 6 oz/contact
Contact Retention after Salt Spray:	Minimum of 5 lbs contact retention
Thermal Vacuum Out gassing:	NASA SP-R-0022
Solder Heat & Contact	360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention:	5 lbs retention force
Solder ability:	MIL-STD-202, Method 208

* Currently Qualified To MIL-DTL-83513 01/02/03/04 Specifications
* Forces as measured using minimum and maximum diameter test sleeves

Dual Row Offset Solder Cup (SS)

The soldercup tails are commonly used for hand soldering applications, and or specific wire based devices that require a small robust connector during one of the final phases of production. Whatever your application, these connectors feature Omnetics' gold plated Flex Pin contact system which meets the performance specifications of MIL-DTL-83513. These connectors are available with mounting holessuitable for PCB and flex mounting. These connectors are available in standard sizes ranging from 2 through 97 positions as well as custom configurations, and accept 26 AWG or smaller stranded wire.

Electrical Mechanical Specifications
Temperature:	-55ºC to 125ºC (200ºC with HTE)
Durability:	500 Cycles
Insulation Resistance:	5,000 Megohms min @ 500 VDC
Voltage Rating (DWV)	600 VAC RMS Sea Level
Shock:	50 G’s discontinuity < 1 microsecond
Vibration:	20 G’s discontinuity < 1 microsecond
Thermal Vacuum Outgassing	NASA SP-R-0022
Contact Resistance:	26 milliohms (65 mV max @ 2.5 amp)
Current Rating:	3 amp per contact
Mating/Unmating Force:	Forces not to exceed 6 oz/contact
Material Specifications
Insulator	Polyphenylene Sulfide per MIL-M-24519
Socket	Gold Plated Copper Alloy
Encapsulant	Epoxy
Standard Pin PCB Tail Termination:	Solder per J-STD-006 (Non-RoHS)
RoHS Pin PCB Tail Termination:	Hard gold plate per ASTM B488
RoHS Socket PCB Tail Termination:	Hard gold plate per ASTM B488

Tested to and passed the following performance specifications of MIL-DTL-83513

Current Rating:	3 amps max
Dielectric Withstanding Voltage	600 VAC RMS
Insulation Resistance:	5000 megohms @ 500 VDC
Contact Resistance	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating Force	Forces not to exceed 10 oz/contact
Temperature Cycling	-55ºC to 125ºC, 5 Cycles
Humidity Mated	IAW EIA-364-31, Method IV, Omit Steps 7A & 7B
Vibration	IAW EIA-364-28, Condition IV
Mechanical Shock:	IAW EIA-364-27, Condition E
Durability	500 cycles
Contact Resistance after Durability	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating after Durability:	Forces not to exceed 6 oz/contact
Salt Spray:	48 hrs IAW-MIL-STD-1344, Method 1001.1, Test Condition B
Low Level Contact Resistance after Salt Spray:	28 milliohms max (2.8 mv) max @ 100 milliamps
Contact Resistance after Salt Spray:	28 milliohms (70 mv) max @ 2.5 amps
Mating/Unmating force after Salt Spray:	Forces not to exceed 6 oz/contact
Contact Retention after Salt Spray:	Minimum of 5 lbs contact retention
Thermal Vacuum Out gassing:	NASA SP-R-0022
Solder Heat & Contact	360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention:	5 lbs retention force
Solder ability:	MIL-STD-202, Method 208

* Currently Qualified To MIL-DTL-83513 01/02/03/04 Specifications
* Forces as measured using minimum and maximum diameter test sleeves

Dual Row Offset Vertical (VV)

Vertical SMT Micro Strip connectors require a minimal amount of board space on flex circuits and rigid circuit boards. These connectors feature Omnetics' highly reliable gold plated Flex Pin contact system which meets the performance specifications of MIL-DTL-83513. These rugged light weight connectors are suitable for the most demanding applications. They are available with mounting holes, suitable for PCB and flex mounting. These connectors are available in standard sizes ranging from 2 through 97 positions as well as custom configurations.

Electrical Mechanical Specifications
Temperature:	-55ºC to 125ºC (200ºC with HTE)
Durability:	500 Cycles
Insulation Resistance:	5,000 Megohms min @ 500 VDC
Voltage Rating (DWV)	600 VAC RMS Sea Level
Shock:	50 G’s discontinuity < 1 microsecond
Vibration:	20 G’s discontinuity < 1 microsecond
Thermal Vacuum Outgassing	NASA SP-R-0022
Contact Resistance:	26 milliohms (65 mV max @ 2.5 amp)
Current Rating:	3 amp per contact
Mating/Unmating Force:	Forces not to exceed 6 oz/contact
Material Specifications
Insulator	Polyphenylene Sulfide per MIL-M-24519
Socket	Gold Plated Copper Alloy
Encapsulant	Epoxy
Standard Pin PCB Tail Termination:	Solder per J-STD-006 (Non-RoHS)
RoHS Pin PCB Tail Termination:	Hard gold plate per ASTM B488
RoHS Socket PCB Tail Termination:	Hard gold plate per ASTM B488

Tested to and passed the following performance specifications of MIL-DTL-83513

Current Rating:	3 amps max
Dielectric Withstanding Voltage	600 VAC RMS
Insulation Resistance:	5000 megohms @ 500 VDC
Contact Resistance	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating Force	Forces not to exceed 10 oz/contact
Temperature Cycling	-55ºC to 125ºC, 5 Cycles
Humidity Mated	IAW EIA-364-31, Method IV, Omit Steps 7A & 7B
Vibration	IAW EIA-364-28, Condition IV
Mechanical Shock:	IAW EIA-364-27, Condition E
Durability	500 cycles
Contact Resistance after Durability	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating after Durability:	Forces not to exceed 6 oz/contact
Salt Spray:	48 hrs IAW-MIL-STD-1344, Method 1001.1, Test Condition B
Low Level Contact Resistance after Salt Spray:	28 milliohms max (2.8 mv) max @ 100 milliamps
Contact Resistance after Salt Spray:	28 milliohms (70 mv) max @ 2.5 amps
Mating/Unmating force after Salt Spray:	Forces not to exceed 6 oz/contact
Contact Retention after Salt Spray:	Minimum of 5 lbs contact retention
Thermal Vacuum Out gassing:	NASA SP-R-0022
Solder Heat & Contact	360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention:	5 lbs retention force
Solder ability:	MIL-STD-202, Method 208

* Currently Qualified To MIL-DTL-83513 01/02/03/04 Specifications
* Forces as measured using minimum and maximum diameter test sleeves

Dual Row Offset Pre-Wired (WD)

Pre-wired offset Dual Row Micro Strip connectors are available with 26 AWG and smaller stranded wire. These assemblies are crimped using proprietary semi-automated crimping systems. Due to the small size and precision required to make these quality crimps, hand crimping is not an option. Pre-crimped wires and contacts are potted in place, further protecting the integrity of the crimp joint. Building these parts to order allows for maximum flexibility in wire type, size and color coding. Commercial off the shelf (COTS) versions are also available with 18” of color coded 26 AWG Teflon for quick turn around. These connectors are available in standard sizes ranging from 2 through 97 positions as well as custom configurations.

Electrical Mechanical Specifications
Temperature:	-55ºC to 125ºC (200ºC with HTE)
Durability:	500 Cycles
Insulation Resistance:	5,000 Megohms min @ 500 VDC
Voltage Rating (DWV)	600 VAC RMS Sea Level
Shock:	50 G’s discontinuity < 1 microsecond
Vibration:	20 G’s discontinuity < 1 microsecond
Thermal Vacuum Outgassing	NASA SP-R-0022
Contact Resistance:	26 milliohms (65 mV max @ 2.5 amp)
Current Rating:	3 amp per contact
Mating/Unmating Force:	Forces not to exceed 6 oz/contact
Material Specifications
Insulator	Polyphenylene Sulfide per MIL-M-24519
Socket	Gold Plated Copper Alloy
Encapsulant	Epoxy
Standard Pin PCB Tail Termination:	Solder per J-STD-006 (Non-RoHS)
RoHS Pin PCB Tail Termination:	Hard gold plate per ASTM B488
RoHS Socket PCB Tail Termination:	Hard gold plate per ASTM B488

Tested to and passed the following performance specifications of MIL-DTL-83513

Current Rating:	3 amps max
Dielectric Withstanding Voltage	600 VAC RMS
Insulation Resistance:	5000 megohms @ 500 VDC
Contact Resistance	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating Force	Forces not to exceed 10 oz/contact
Temperature Cycling	-55ºC to 125ºC, 5 Cycles
Humidity Mated	IAW EIA-364-31, Method IV, Omit Steps 7A & 7B
Vibration	IAW EIA-364-28, Condition IV
Mechanical Shock:	IAW EIA-364-27, Condition E
Durability	500 cycles
Contact Resistance after Durability	26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating after Durability:	Forces not to exceed 6 oz/contact
Salt Spray:	48 hrs IAW-MIL-STD-1344, Method 1001.1, Test Condition B
Low Level Contact Resistance after Salt Spray:	28 milliohms max (2.8 mv) max @ 100 milliamps
Contact Resistance after Salt Spray:	28 milliohms (70 mv) max @ 2.5 amps
Mating/Unmating force after Salt Spray:	Forces not to exceed 6 oz/contact
Contact Retention after Salt Spray:	Minimum of 5 lbs contact retention
Thermal Vacuum Out gassing:	NASA SP-R-0022
Solder Heat & Contact	360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention:	5 lbs retention force
Solder ability:	MIL-STD-202, Method 208

* Currently Qualified To MIL-DTL-83513 01/02/03/04 Specifications
* Forces as measured using minimum and maximum diameter test sleeves

Micro-D

Bi-Lobe® / Nano-D

Micro and Nano Strips

Micro and Nano Circulars

High Speed

Polarized Nano

Power & Signal Hybrids

Nano Coax Connectors

Neuro Connectors

IP68

Standards

COTS

Dual Row Offset Horizontal SMT (AA)

Dual Row Offset Straight Tail (DD)

Dual Row Offset Flex Tail (FF)

Horizontal Thru-Hole - Type H2

Dual Row Offset Solder Cup (SS)

Dual Row Offset Vertical (VV)

Dual Row Offset Pre-Wired (WD)

Micro-D

Bi-Lobe® / Nano-D

Micro and Nano Strips

Micro and Nano Circulars

High Speed

Polarized Nano

Power & Signal Hybrids

Nano Coax Connectors

Neuro Connectors

IP68

Standards

COTS