Nano 360® Circulars Threaded Panel Mount - Wired/Cable

Omnetics nano series of circular connectors are now available with threaded metal housings giving them a positive lock and environmental seal. These are the smallest Mil-Quality circulars available today. With the ability to withstand high shock and vibrations while maintaining electrical integrity, they are ideal for the most demanding applications where size and weight are critical. These connectors can be configured with different levels of waterproof sealing up to IP-68. A variety of shell material and finishes are available including nickel plated brass and back oxide stainless steel.

These high density multi-position connectors are available in four shell sizes: 6, 11, 16 & 28 positions arranged on a .025” (.64 mm) pitch and are capable of 1 amp per contact. Utilizing a military quality contact system, these connectors are perfect for mission critical applications where size, weight and reliability are crucial.

Electrical Mechanical Specifications
Temperature:	-55ºC to 125ºC (200ºC with HTE)
Insulation Resistance:	5000 megohms min @ 500 VDC
Contact Resistance:	71 Milliohm Max (71 mV Drop Max) @ 1.0 AMPs
Voltage Rating (DWV)	250 VAC RMS
Shock:	100 g’s with no discontinuties > 10 nanoseconds
Vibration:	20 g’s with no discontinuties > 10 nanoseconds
Current Rating:	1 AMP per contact
Sealing:	Consult Factory for more options.
Thermal Vacuum Outgassing:	1.0% max TML, 0.03% max CVCM
Mating/Unmating Force:	2.5 oz (71 g) typical per contact
Material Specifications
Shell Material and Finish	Ni Plated Brass or Black Ni. Contact Factory for other Materials
Insulator	Thermoplastic Polymer, Per MIL-DTL-24519
Pin	Beryllium Copper per ASTM B194, Alloy C17200
Socket	Copper Alloy MIL-DTL-83513
Encapsulant	Epoxy

Tested to and passed the following performance specifications of MIL-DTL-32139

Dielectric Withstanding Voltage	250 VAC initial, 100 VAC after Humidity
Insulation Resistance:	5000 megohms min @ 100 VDC
Contact Resistance	71 mv @ 1 amp
Mating/Unmating Force	Forces not to exceed 7 oz/contact
Temperature Cycling	-55ºC to +125ºC, 5 Cycles
Humidity Mated	Per EIA-364, procedure 31-B, except omit steps 7A & 7B
Vibration	20 g's - no discontinuity greater than 10 nanoseconds*
Mechanical Shock:	100 g's - no discontinuity greater than 10 nanoseconds*
Durability	200 cycles
Contact Resistance after Durability	71 mv max @ 1 amp
Mating/Unmating after Durability:	Forces not to exceed 7 oz/contact
Salt Spray:	Per EIA-364, procedure 26-B
Low Level Contact Resistance after Salt Spray:	Max resistance 28 milliohms
Contact Resistance after Salt Spray:	70 mv max @ 1 amps
Mating/Unmating force after Salt Spray:	Forces not to exceed 7 oz/contact
Contact Retention after Salt Spray:	Minimum of 2 lbs contact retention
Thermal Vacuum Out gassing:	NASA SP-R-0022 **
Solder Heat & Contact	360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention:	5 lbs retention force
Solder ability:	Per EIA-364, procedure 56

* Tested and passed while monitoring for open circuits greater than 100 nanoseconds
** NASA requirement Requirements in Blue exceed the 32139 requirements

Nano 360® Circular Threaded Metal Shell - Discrete Wired/Cable

Electrical Mechanical Specifications
Temperature:	-55ºC to 125ºC (200ºC with HTE)
Insulation Resistance:	5000 megohms min @ 500 VDC
Contact Resistance:	71 Milliohm Max (71 mV Drop Max) @ 1.0 AMPs
Voltage Rating (DWV)	250 VAC RMS
Shock:	100 g’s with no discontinuties > 10 nanoseconds
Vibration:	20 g’s with no discontinuties > 10 nanoseconds
Current Rating:	1 AMP per contact
Sealing:	Consult Factory for more options.
Thermal Vacuum Outgassing:	1.0% max TML, 0.03% max CVCM
Mating/Unmating Force:	2.5 oz (71 g) typical per contact
Material Specifications
Shell Material and Finish	Ni Plated Brass or Black Ni. Contact Factory for other Materials
Insulator	Thermoplastic Polymer, Per MIL-DTL-24519
Pin	Beryllium Copper per ASTM B194, Alloy C17200
Socket	Copper Alloy MIL-DTL-83513
Encapsulant	Epoxy

Tested to and passed the following performance specifications of MIL-DTL-32139

Dielectric Withstanding Voltage	250 VAC initial, 100 VAC after Humidity
Insulation Resistance:	5000 megohms min @ 100 VDC
Contact Resistance	71 mv @ 1 amp
Mating/Unmating Force	Forces not to exceed 7 oz/contact
Temperature Cycling	-55ºC to +125ºC, 5 Cycles
Humidity Mated	Per EIA-364, procedure 31-B, except omit steps 7A & 7B
Vibration	20 g's - no discontinuity greater than 10 nanoseconds*
Mechanical Shock:	100 g's - no discontinuity greater than 10 nanoseconds*
Durability	200 cycles
Contact Resistance after Durability	71 mv max @ 1 amp
Mating/Unmating after Durability:	Forces not to exceed 7 oz/contact
Salt Spray:	Per EIA-364, procedure 26-B
Low Level Contact Resistance after Salt Spray:	Max resistance 28 milliohms
Contact Resistance after Salt Spray:	70 mv max @ 1 amps
Mating/Unmating force after Salt Spray:	Forces not to exceed 7 oz/contact
Contact Retention after Salt Spray:	Minimum of 2 lbs contact retention
Thermal Vacuum Out gassing:	NASA SP-R-0022 **
Solder Heat & Contact	360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention:	5 lbs retention force
Solder ability:	Per EIA-364, procedure 56

* Tested and passed while monitoring for open circuits greater than 100 nanoseconds
** NASA requirement Requirements in Blue exceed the 32139 requirements

Micro-D

Bi-Lobe® / Nano-D

Micro and Nano Strips

Micro and Nano Circulars

High Speed

Polarized Nano

Power & Signal Hybrids

Nano Coax Connectors

Neuro Connectors

IP68

Standards

COTS