Nano 360® Plastic Circulars - Straight

The Nano Circular Series utilizes Omnetics' rugged and reliable Flex-Pin contact system. Spaced on 25 mil (.64mm) centerlines and a 9.0 mm mated length, these connectors are the smallest Mil-Quality circulars available today. Extremely small outer diameters range from .122" (3.1 mm) to .217" (5.5 mm). With the ability to withstand high shock and vibration while maintaining their electrical integrity, these connectors are ideal for the most demanding applications.
Gold plated contacts are polarized and shrouded by our unique Liquid Crystal Polymer housing, making these connectors capable of over 2,000 mating cycles.

6, 11, 16 & 28 positions housing sizes are available in pre-wired and solid straight tail versions.

Elaborate wire harnesses, flex termination, overmolding and custom shells are all available upon request.

Electrical Mechanical Specifications
Temperature:	-55ºC to 125ºC (200ºC with HTE)
Insulation Resistance:	5000 megohms min @ 100 VDC
Contact Resistance:	71 milliohms (71 mV) Max @ 1 AMPs
Voltage Rating (DWV)	250 VAC RMS @ sea level
Shock:	100 g’s with no discontinuties > 10 nanoseconds
Vibration:	20 g’s with no discontinuties > 10 nanoseconds
Current Rating:	1 AMP per contact
Sealing:	Consult Factory for more options.
Thermal Vacuum Outgassing:	1.0% max TML, 0.03% max CVCM
Material Specifications
Insulator	Thermoplastic Polymer, Per MIL-DTL-24519
Pin	Beryllium Copper per ASTM B194, Alloy C17200
Socket	Copper Alloy MIL-DTL-83513
Encapsulant	Epoxy
Standard PC Tail Finish	Solder per J-STD-006 (Non-RoHS)
RoHS PC Tail Finish	Hard gold plate per ASTM B488

Tested to and passed the following performance specifications of MIL-DTL-32139

Dielectric Withstanding Voltage	250 VAC initial, 100 VAC after Humidity
Insulation Resistance:	5000 megohms min @ 100 VDC
Contact Resistance	71 mv @ 1 amp
Mating/Unmating Force	Forces not to exceed 7 oz/contact
Temperature Cycling	-55ºC to +125ºC, 5 Cycles
Humidity Mated	Per EIA-364, procedure 31-B, except omit steps 7A & 7B
Vibration	20 g's - no discontinuity greater than 10 nanoseconds*
Mechanical Shock:	100 g's - no discontinuity greater than 10 nanoseconds*
Durability	200 cycles
Contact Resistance after Durability	71 mv max @ 1 amp
Mating/Unmating after Durability:	Forces not to exceed 7 oz/contact
Salt Spray:	Per EIA-364, procedure 26-B
Low Level Contact Resistance after Salt Spray:	Max resistance 28 milliohms
Contact Resistance after Salt Spray:	70 mv max @ 1 amps
Mating/Unmating force after Salt Spray:	Forces not to exceed 7 oz/contact
Contact Retention after Salt Spray:	Minimum of 2 lbs contact retention
Thermal Vacuum Out gassing:	NASA SP-R-0022 **
Solder Heat & Contact	360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention:	5 lbs retention force
Solder ability:	Per EIA-364, procedure 56

* Tested and passed while monitoring for open circuits greater than 100 nanoseconds
** NASA requirement Requirements in Blue exceed the 32139 requirements

Nano 360® Plastic Circulars - Discrete Wire/Cable

Gold plated contacts are polarized and shrouded by our unique Liquid Crystal Polymer housing, making these connectors capable of over 2,000 mating cycles.

6, 11, 16 & 28 positions housing sizes are available in pre-wired and solid straight tail versions.

Elaborate wire harnesses, flex termination, overmolding and custom shells are all available upon request.

Clip option is also available. See "accessories" tab below.

Electrical Mechanical Specifications
Temperature:	-55ºC to 125ºC (200ºC with HTE)
Insulation Resistance:	5000 megohms min @ 100 VDC
Contact Resistance:	71 milliohms (71 mV) Max @ 1 AMPs
Voltage Rating (DWV)	250 VAC RMS @ sea level
Shock:	100 g’s with no discontinuties > 10 nanoseconds
Vibration:	20 g’s with no discontinuties > 10 nanoseconds
Current Rating:	1 AMP per contact
Sealing:	Consult Factory for more options.
Thermal Vacuum Outgassing:	1.0% max TML, 0.03% max CVCM
Material Specifications
Insulator	Thermoplastic Polymer, Per MIL-DTL-24519
Pin	Beryllium Copper per ASTM B194, Alloy C17200
Socket	Copper Alloy MIL-DTL-83513
Encapsulant	Epoxy

Tested to and passed the following performance specifications of MIL-DTL-32139

Dielectric Withstanding Voltage	250 VAC initial, 100 VAC after Humidity
Insulation Resistance:	5000 megohms min @ 100 VDC
Contact Resistance	71 mv @ 1 amp
Mating/Unmating Force	Forces not to exceed 7 oz/contact
Temperature Cycling	-55ºC to +125ºC, 5 Cycles
Humidity Mated	Per EIA-364, procedure 31-B, except omit steps 7A & 7B
Vibration	20 g's - no discontinuity greater than 10 nanoseconds*
Mechanical Shock:	100 g's - no discontinuity greater than 10 nanoseconds*
Durability	200 cycles
Contact Resistance after Durability	71 mv max @ 1 amp
Mating/Unmating after Durability:	Forces not to exceed 7 oz/contact
Salt Spray:	Per EIA-364, procedure 26-B
Low Level Contact Resistance after Salt Spray:	Max resistance 28 milliohms
Contact Resistance after Salt Spray:	70 mv max @ 1 amps
Mating/Unmating force after Salt Spray:	Forces not to exceed 7 oz/contact
Contact Retention after Salt Spray:	Minimum of 2 lbs contact retention
Thermal Vacuum Out gassing:	NASA SP-R-0022 **
Solder Heat & Contact	360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention:	5 lbs retention force
Solder ability:	Per EIA-364, procedure 56

* Tested and passed while monitoring for open circuits greater than 100 nanoseconds
** NASA requirement Requirements in Blue exceed the 32139 requirements

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