Micro 360® Plastic Circular Straight Tail (DD)

The Micro Circular Series utilizes Omnetics' rugged and reliable Flex-Pin contact system. Spaced on 50 mil (1.27mm) centerlines they feature a mated length of less than 12.4 mm. Both the male and female contacts are shrouded by the plastic insulators insuring that the contacts are protected during mating and unmating. Outer diameters range from 5.6 mm to 10.0 mm. With the ability to withstand high shock and vibration while maintaining their electrical integrity, these connectors are ideal for the most demanding applications. Gold plated Beryllium Copper flex pins are capable of over 2,000 mating cycles.


5, 7, 12, 16, 27 & 39  positions housing sizes are available in pre-wired, soldercup and solid straight tail versions.
Elaborate wire harnesses, flex termination, overmolding and custom shells are all available upon request.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Contact Resistance: 26 milliohms (65 mV) Max @ 2.5 AMPs
Insulation Resistance: 5,000 megohms min @ 500 VDC
Voltage Rating (DWV) 600 VAC RMS at Sea Level
Shock: 50 g’s with no discontinuties > 1 microsecond     
Vibration: 20 g’s with no discontinuties > 1 microsecond     
Thermal Vacuum Outgassing 1.0% max TML, 0.03% max CVCM
Current Rating: 3 AMPs per contact
Material Specifications
Insulator LCP per MIL-M-24519, Type GLCP-30F
Pin Beryllium Copper per ASTM B194, Alloy C17200  
Socket Gold Plate per ASTM B488, Type II (Hard Gold), Code C, Class 1.27, .000050".(1.27 um)
Encapsulant Epoxy
Standard PC Tail Finish Solder per J-STD-006 (Non-RoHS)
RoHS PC Tail Finish Hard gold plate per ASTM B488

 

 

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Tested to and passed the following performance specifications of MIL-DTL-83513

Current Rating: 3 amps max
Dielectric Withstanding Voltage  600 VAC RMS
Insulation Resistance: 5000 megohms @ 500 VDC
Contact Resistance 26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating Force Forces not to exceed 10 oz/contact   
Temperature Cycling -55ºC to 125ºC, 5 Cycles
Humidity Mated    IAW EIA-364-31, Method IV, Omit Steps 7A & 7B
Vibration IAW EIA-364-28, Condition IV
Mechanical Shock: IAW EIA-364-27, Condition E
Durability 500 cycles
Contact Resistance after Durability  26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating after Durability: Forces not to exceed 6 oz/contact      
Salt Spray: 48 hrs IAW-MIL-STD-1344, Method 1001.1, Test Condition B
Low Level Contact Resistance after Salt Spray:  28 milliohms max (2.8 mv) max @ 100 milliamps
Contact Resistance after Salt Spray: 28 milliohms (70 mv) max @ 2.5 amps
Mating/Unmating force after Salt Spray: Forces not to exceed 6 oz/contact
Contact Retention after Salt Spray: Minimum of 5 lbs contact retention
Thermal Vacuum Out gassing: NASA SP-R-0022
Solder Heat & Contact 360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention: 5 lbs retention force
Solder ability: MIL-STD-202, Method 208

 

* Currently Qualified To MIL-DTL-83513 01/02/03/04 Specifications
* Forces as measured using minimum and maximum diameter test sleeves

Micro 360® Plastic Circular Right Angle (RA)

The Micro Circular Series utilizes Omnetics' rugged and reliable Flex-Pin contact system. Spaced on 50 mil (1.27mm) centerlines they feature a mated length of less than 12.4 mm. Both the male and female contacts are shrouded by the plastic insulators insuring that the contacts are protected during mating and unmating. Outer diameters range from 5.6 mm to 10.0 mm. With the ability to withstand high shock and vibration while maintaining their electrical integrity, these connectors are ideal for the most demanding applications. Gold plated Beryllium Copper flex pins are capable of over 2,000 mating cycles.
5 & 12 positions housing sizes are available in right angle thru-hole tail versions.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Contact Resistance: 26 milliohms (65 mV) Max @ 2.5 AMPs
Insulation Resistance: 5,000 megohms min @ 500 VDC
Voltage Rating (DWV) 600 VAC RMS at Sea Level
Shock: 50 g’s with no discontinuties > 1 microsecond     
Vibration: 20 g’s with no discontinuties > 1 microsecond     
Thermal Vacuum Outgassing 1.0% max TML, 0.03% max CVCM
Current Rating: 3 AMPs per contact
Material Specifications
Insulator LCP per MIL-M-24519, Type GLCP-30F
Pin Beryllium Copper per ASTM B194, Alloy C17200  
Socket Gold Plate per ASTM B488, Type II (Hard Gold), Code C, Class 1.27, .000050".(1.27 um)
Encapsulant Epoxy
Standard PC Tail Finish Solder per J-STD-006 (Non-RoHS)
RoHS PC Tail Finish Hard gold plate per ASTM B488

 

 

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Tested to and passed the following performance specifications of MIL-DTL-83513

Current Rating: 3 amps max
Dielectric Withstanding Voltage  600 VAC RMS
Insulation Resistance: 5000 megohms @ 500 VDC
Contact Resistance 26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating Force Forces not to exceed 10 oz/contact   
Temperature Cycling -55ºC to 125ºC, 5 Cycles
Humidity Mated    IAW EIA-364-31, Method IV, Omit Steps 7A & 7B
Vibration IAW EIA-364-28, Condition IV
Mechanical Shock: IAW EIA-364-27, Condition E
Durability 500 cycles
Contact Resistance after Durability  26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating after Durability: Forces not to exceed 6 oz/contact      
Salt Spray: 48 hrs IAW-MIL-STD-1344, Method 1001.1, Test Condition B
Low Level Contact Resistance after Salt Spray:  28 milliohms max (2.8 mv) max @ 100 milliamps
Contact Resistance after Salt Spray: 28 milliohms (70 mv) max @ 2.5 amps
Mating/Unmating force after Salt Spray: Forces not to exceed 6 oz/contact
Contact Retention after Salt Spray: Minimum of 5 lbs contact retention
Thermal Vacuum Out gassing: NASA SP-R-0022
Solder Heat & Contact 360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention: 5 lbs retention force
Solder ability: MIL-STD-202, Method 208

 

* Currently Qualified To MIL-DTL-83513 01/02/03/04 Specifications
* Forces as measured using minimum and maximum diameter test sleeves

Micro 360® Plastic Circular Solder Cup (SS)

The Micro Circular Series utilizes Omnetics' rugged and reliable Flex-Pin contact system. Spaced on 50 mil (1.27mm) centerlines they feature a mated length of less than 12.4 mm. Both the male and female contacts are shrouded by the plastic insulators insuring that the contacts are protected during mating and unmating. Outer diameters range from 5.6 mm to 10.0 mm. With the ability to withstand high shock and vibration while maintaining their electrical integrity, these connectors are ideal for the most demanding applications. Gold plated Beryllium Copper flex pins are capable of over 2,000 mating cycles.
5, 7, 12, 16, 27 & 39 positions housing sizes are available in pre-wired, soldercup and solid straight tail versions.
Elaborate wire harnesses, flex termination, overmolding and custom shells are all available upon request.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Contact Resistance: 26 milliohms (65 mV) Max @ 2.5 AMPs
Insulation Resistance: 5,000 megohms min @ 500 VDC
Voltage Rating (DWV) 600 VAC RMS at Sea Level
Shock: 50 g’s with no discontinuties > 1 microsecond     
Vibration: 20 g’s with no discontinuties > 1 microsecond     
Thermal Vacuum Outgassing 1.0% max TML, 0.03% max CVCM
Current Rating: 3 AMPs per contact
Material Specifications
Insulator LCP per MIL-M-24519, Type GLCP-30F
Pin Beryllium Copper per ASTM B194, Alloy C17200  
Socket Gold Plate per ASTM B488, Type II (Hard Gold), Code C, Class 1.27, .000050".(1.27 um)
Encapsulant Epoxy
Standard PC Tail Finish Solder per J-STD-006 (Non-RoHS)
RoHS PC Tail Finish Hard gold plate per ASTM B488

 

 

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Tested to and passed the following performance specifications of MIL-DTL-83513

Current Rating: 3 amps max
Dielectric Withstanding Voltage  600 VAC RMS
Insulation Resistance: 5000 megohms @ 500 VDC
Contact Resistance 26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating Force Forces not to exceed 10 oz/contact   
Temperature Cycling -55ºC to 125ºC, 5 Cycles
Humidity Mated    IAW EIA-364-31, Method IV, Omit Steps 7A & 7B
Vibration IAW EIA-364-28, Condition IV
Mechanical Shock: IAW EIA-364-27, Condition E
Durability 500 cycles
Contact Resistance after Durability  26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating after Durability: Forces not to exceed 6 oz/contact      
Salt Spray: 48 hrs IAW-MIL-STD-1344, Method 1001.1, Test Condition B
Low Level Contact Resistance after Salt Spray:  28 milliohms max (2.8 mv) max @ 100 milliamps
Contact Resistance after Salt Spray: 28 milliohms (70 mv) max @ 2.5 amps
Mating/Unmating force after Salt Spray: Forces not to exceed 6 oz/contact
Contact Retention after Salt Spray: Minimum of 5 lbs contact retention
Thermal Vacuum Out gassing: NASA SP-R-0022
Solder Heat & Contact 360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention: 5 lbs retention force
Solder ability: MIL-STD-202, Method 208

 

* Currently Qualified To MIL-DTL-83513 01/02/03/04 Specifications
* Forces as measured using minimum and maximum diameter test sleeves

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Micro 360® Plastic Circular Discrete Wire/Cable

The Micro Circular Series utilizes Omnetics' rugged and reliable Flex-Pin contact system. Spaced on 50 mil (1.27mm) centerlines they feature a mated length of less than 12.4 mm. Both the male and female contacts are shrouded by the plastic insulators insuring that the contacts are protected during mating and unmating. Outer diameters range from 5.6 mm to 10.0 mm. With the ability to withstand high shock and vibration while maintaining their electrical integrity, these connectors are ideal for the most demanding applications. Gold plated Beryllium Copper flex pins are capable of over 2,000 mating cycles.

5, 7, 12, 16, 27 & 39  positions housing sizes are available in pre-wired, soldercup and solid straight tail versions.
Elaborate wire harnesses, flex termination, overmolding and custom shells are all available upon request.

Clip option is also available. See "accessories" tab below.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Contact Resistance: 26 milliohms (65 mV) Max @ 2.5 AMPs
Insulation Resistance: 5,000 megohms min @ 500 VDC
Voltage Rating (DWV) 600 VAC RMS at Sea Level
Shock: 50 g’s with no discontinuties > 1 microsecond     
Vibration: 20 g’s with no discontinuties > 1 microsecond     
Thermal Vacuum Outgassing 1.0% max TML, 0.03% max CVCM
Current Rating: 3 AMPs per contact
Material Specifications
Insulator LCP per MIL-M-24519, Type GLCP-30F
Pin Beryllium Copper per ASTM B194, Alloy C17200  
Socket Gold Plate per ASTM B488, Type II (Hard Gold), Code C, Class 1.27, .000050".(1.27 um)
Encapsulant Epoxy
Standard PC Tail Finish Solder per J-STD-006 (Non-RoHS)
RoHS PC Tail Finish Hard gold plate per ASTM B488

 

 

This PDF requires the free Adobe Reader.

Click here to dowload the Adobe Reader

This PDF requires the free Adobe Reader.

Click here to dowload the Adobe Reader

This PDF requires the free Adobe Reader.

Click here to dowload the Adobe Reader

Tested to and passed the following performance specifications of MIL-DTL-83513

Current Rating: 3 amps max
Dielectric Withstanding Voltage  600 VAC RMS
Insulation Resistance: 5000 megohms @ 500 VDC
Contact Resistance 26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating Force Forces not to exceed 10 oz/contact   
Temperature Cycling -55ºC to 125ºC, 5 Cycles
Humidity Mated    IAW EIA-364-31, Method IV, Omit Steps 7A & 7B
Vibration IAW EIA-364-28, Condition IV
Mechanical Shock: IAW EIA-364-27, Condition E
Durability 500 cycles
Contact Resistance after Durability  26 milliohms (65 mv) max @ 2.5 amps
Mating/Unmating after Durability: Forces not to exceed 6 oz/contact      
Salt Spray: 48 hrs IAW-MIL-STD-1344, Method 1001.1, Test Condition B
Low Level Contact Resistance after Salt Spray:  28 milliohms max (2.8 mv) max @ 100 milliamps
Contact Resistance after Salt Spray: 28 milliohms (70 mv) max @ 2.5 amps
Mating/Unmating force after Salt Spray: Forces not to exceed 6 oz/contact
Contact Retention after Salt Spray: Minimum of 5 lbs contact retention
Thermal Vacuum Out gassing: NASA SP-R-0022
Solder Heat & Contact 360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention: 5 lbs retention force
Solder ability: MIL-STD-202, Method 208

 

* Currently Qualified To MIL-DTL-83513 01/02/03/04 Specifications
* Forces as measured using minimum and maximum diameter test sleeves