Nano-D / Bi-Lobe® Single Row Horizontal SMT (AA)

Single Row Horizontal SMT Nano-D / Bi-Lobe® nanos offer an extremely low profile package that is well suited for pick and place mounting methods. They have a very tight pitch of .025" (.64 mm) centerlines.

These connectors featuring Omnetics highly reliable gold plated Flex Pin contact system, conforming to the requirements of MIL-DTL-32139. These rugged lightweight connectors are suitable for the most demanding applications.

Available with threaded mounting holes suitable for PCB and flex mounting. These connectors are available in standard sizes ranging from 5 through 51 positions, as well as custom configurations.

Nano-D / Bi-Lobe® (AA) Contacts

Nano-D / Bi-Lobe® (AA) Guide

Nano-D / Bi-Lobe® (AA) Accessories

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5,000 megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s with no discontinuties > 10 nanoseconds    
Vibration: 20 g’s with no discontinuties > 10 nanoseconds     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 AMP
Current Rating: 1 AMP per contact
Mating/Unmating Force: 7 oz. (198 g) max per contact
Material Specifications
Shell Material and Finish: Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator: Liquid Crystal Polymer per MIL-DTL-32139 or PEEK 
Pin: Gold Plated BeCu
Socket: Gold Plated Copper Alloy
Encapsulant: Epoxy

 

 

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Nano-D / Bi-Lobe® Connectors - Single Row Vertical SMT (VV)

Vertical SMT Bi-Lobe® nanos require a minimal amount of board space on flex circuits and rigid circuit boards. These connectors feature Omnetics highly reliable gold plated Flex Pin contact system conforming to the requirements of MIL-DTL-32139.

Set on a .025" (.64 mm) pitch, these rugged lightweight connectors are suitable for the most demanding applications. They are available with threaded mounting holes and retention screws.

Shell material choices include Aluminum and Stainless steel with multiple standard and custom plating options upon request. These connectors are available in standard sizes ranging from 5 through 51 positions, as well as custom configurations.

Nano-D / Bi-Lobe® (VV) Contacts

Nano-D / Bi-Lobe® (VV) Guide

Nano-D / Bi-Lobe® (VV) Accessories

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5,000 megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s with no discontinuties > 10 nanoseconds    
Vibration: 20 g’s with no discontinuties > 10 nanoseconds     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 AMP
Current Rating: 1 AMP per contact
Mating/Unmating Force: 7 oz. (198 g) max per contact
Material Specifications
Shell Material and Finish: Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator: Liquid Crystal Polymer per MIL-DTL-32139 or PEEK 
Pin: Gold Plated BeCu
Socket: Gold Plated Copper Alloy
Encapsulant: Epoxy

 

 

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Nano-D / Bi-Lobe® Single Row Straight Tails (DD)

Single Row Nano-D / Bi-Lobe® nanos can be loaded with simple straight tails (Integral or Crimped). Suitable for vertical thruhole mounting to fine pitched flex circuits, they are designed on .025" (.64 mm) centerlines.

The straight tails are also commonly used in ultra fine wirewrap termination, such as used in electro-physiology. These durable lightweight connectors utilize Omnetics’ gold plated Flex Pin contact system and are suitable for the most demanding applications. They are inter-mateable with Omnetics QPL versions of MIL-DTL-32139.

These connectors are available in standard sizes ranging from 5 through 51 positions, as well as custom configurations. Flex design and termination is available. Please contact us for more information.

Nano-D / Bi-Lobe® (DD) Contacts

Nano-D / Bi-Lobe® (DD) Guide

Nano-D / Bi-Lobe® (DD) Accessories

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5,000 megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s with no discontinuties > 10 nanoseconds    
Vibration: 20 g’s with no discontinuties > 10 nanoseconds     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 AMP
Current Rating: 1 AMP per contact
Mating/Unmating Force: 7 oz. (198 g) max per contact
Material Specifications
Shell Material and Finish: Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator: Liquid Crystal Polymer per MIL-DTL-32139 or PEEK 
Pin: Gold Plated BeCu
Socket: Gold Plated Copper Alloy
Encapsulant: Epoxy

 

 

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Nano-D / Bi-Lobe® Single Row Thru-Hole Horizontal (H2)

Single Row Horizontal SMT Nano-D / Bi-Lobe® nanos offer an extremely low profile package that is well suited for pick and place mounting methods. They have a very tight pitch of .025" (.64 mm) centerlines.

Nano-D / Bi-Lobe® (H2) Contacts

Nano-D / Bi-Lobe® (H2) Guide

Nano-D / Bi-Lobe® (H2) Accessories

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5,000 megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s with no discontinuties > 10 nanoseconds    
Vibration: 20 g’s with no discontinuties > 10 nanoseconds     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 AMP
Current Rating: 1 AMP per contact
Mating/Unmating Force: 7 oz. (198 g) max per contact
Material Specifications
Shell Material and Finish: Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator: Liquid Crystal Polymer per MIL-DTL-32139 or PEEK 
Pin: Gold Plated BeCu
Socket: Gold Plated Copper Alloy
Encapsulant: Epoxy

 

 

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Nano-D / Bi-Lobe® Connectors - Single Row Thru-Hole Vertical (V2)

The Single Row Bi-Lobe® V2 nanos have contacts arranged on .025" (.64 mm) centerlines. The thru-hole tails are spread into a mounting pattern on .050" (1.27 mm) centers, allowing space for traces and annular rings.

Featuring Omnetics gold plated Flex Pin contact system, these durable lightweight connectors are perfect for the most demanding applications and are inter-mateable with our QPL versions of Military Specification MIL-DTL-32139.

They are available with retention screws for a positive lock. Shell material options include Aluminum and Stainless steel with multiple standard and custom plating options upon request. These connectors are available in standard sizes ranging from 9 through 65 positions, as well as custom configurations.

Nano-D / Bi-Lobe® (V2) Contacts

Nano-D / Bi-Lobe® (V2) Guide

Nano-D / Bi-Lobe® (V2) Accessories

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5,000 megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s with no discontinuties > 10 nanoseconds    
Vibration: 20 g’s with no discontinuties > 10 nanoseconds     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 AMP
Current Rating: 1 AMP per contact
Mating/Unmating Force: 7 oz. (198 g) max per contact
Material Specifications
Shell Material and Finish: Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator: Liquid Crystal Polymer per MIL-DTL-32139 or PEEK 
Pin: Gold Plated BeCu
Socket: Gold Plated Copper Alloy
Encapsulant: Epoxy

 

 

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Nano-D / Bi-Lobe® Connectors - Single Row (WD)

Pre-Wired Single Row Bi-Lobe® nanos are available with 30 AWG and smaller stranded wire. These assemblies are crimped using proprietary semi-automated crimping systems. Due to their small size and precision required to make these quality crimps, hand crimping is not an option. Precrimped wires and contacts are potted in place further protecting the integrity of the crimp joint.

Building these parts to order allows for maximum flexibility in wire type, size and color coding. Off the shelf (COTS) versions are also available with 18" of color coded 30 AWG Teflon for quick turn around.

These connectors are available in standard sizes ranging from 9 through 65 positions, as well as custom configurations. Full QPL versions of MIL-DTL-32139 are also available from Omnetics.

Nano-D / Bi-Lobe® (WD) Contacts

Nano-D / Bi-Lobe® (WD) Guide

Nano-D / Bi-Lobe® (WD) Accessories

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5,000 megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s with no discontinuties > 10 nanoseconds    
Vibration: 20 g’s with no discontinuties > 10 nanoseconds     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 AMP
Current Rating: 1 AMP per contact
Mating/Unmating Force: 7 oz. (198 g) max per contact
Material Specifications
Shell Material and Finish: Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator: Liquid Crystal Polymer per MIL-DTL-32139 or PEEK 
Pin: Gold Plated BeCu
Socket: Gold Plated Copper Alloy
Encapsulant: Epoxy

 

 

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Nano-D / Bi-Lobe® Connectors - Single Row Jumpers (JU)

Single Row Bi-Lobe® nano harnesses are available with 30 AWG and smaller stranded wire. These multi connector assemblies are crimped using proprietary semi-automated crimping systems.

Their ultra small profile, .025" (.64 mm) centerlines, makes them an excellent choice for complex wire routing in tight spaces. These connectors feature Omnetics’ highly dependable gold plated Flex Pin contact system conforming to the requirements of MIL-DTL-32139.

These connectors are available in standard sizes ranging from 5 through 51 positions, as well as custom configurations

Nano-D / Bi-Lobe® (JU) Contacts

Nano-D / Bi-Lobe® (JU) Guide

Nano-D / Bi-Lobe® (JU) Accessories

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5,000 megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s with no discontinuties > 10 nanoseconds    
Vibration: 20 g’s with no discontinuties > 10 nanoseconds     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 AMP
Current Rating: 1 AMP per contact
Mating/Unmating Force: 7 oz. (198 g) max per contact
Material Specifications
Shell Material and Finish: Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator: Liquid Crystal Polymer per MIL-DTL-32139 or PEEK 
Pin: Gold Plated BeCu
Socket: Gold Plated Copper Alloy
Encapsulant: Epoxy

 

 

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Nano-D / Bi-Lobe® Single Row MIL-DTL-32139 QPL

Pre-Wired Single Row Bi-Lobe® nanos can be ordered with full QPL approval. These assemblies are crimped using proprietary automated crimping systems in Omnetics MIL-STD-790 approved manufacturing facility pre-crimped wires & contacts are potted in place further protecting the integrity of the crimp joint.

Building these as full QPL parts gives users an added level of confidence of critical applications.

Commercial off the shelf(COTS) non-QPL versions are also available with 18" of color coded 30 AWG Teflon for quick turn aroiund.

These connectors are available in standard sizes ranging from 5 through 51 positions.

Nano-D / Bi-Lobe® (MIL-DTL-32139 QPL) Contacts

Nano-D / Bi-Lobe® (MIL-DTL-32139 QPL) Guide

Nano-D / Bi-Lobe® (MIL-DTL-32139 QPL) Accessories

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5,000 megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s with no discontinuties > 10 nanoseconds    
Vibration: 20 g’s with no discontinuties > 10 nanoseconds     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 AMP
Current Rating: 1 AMP per contact
Mating/Unmating Force: 7 oz. (198 g) max per contact
Material Specifications
Shell Material and Finish: Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator: Liquid Crystal Polymer per MIL-DTL-32139 or PEEK 
Pin: Gold Plated BeCu
Socket: Gold Plated Copper Alloy
Encapsulant: Epoxy

 

 

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Tested to and passed the following performance specifications of MIL-DTL-32139

Dielectric Withstanding Voltage  250 VAC initial, 100 VAC after Humidity
Insulation Resistance: 5000 megohms min
Contact Resistance 71 mV max @ 1 amp
Mating/Unmating Force Forces not to exceed 7 oz/contact   
Temperature Cycling -55ºC to 125ºC, 5 Cycles
Humidity Mated    Per EIA-364, procedure 31-B, except omit steps 7A & 7B 
Vibration 20 g's - no discontinuity greater than 10 nanoseconds*
Mechanical Shock: 100 g's - no discontinuity greater than 10 nanoseconds*
Durability 200 cycles
Contact Resistance after Durability  71 mv max @ 1 amps
Mating/Unmating after Durability: Forces not to exceed 7 oz/contact      
Salt Spray: Per EIA-364, procedure 26-B
Low Level Contact Resistance after Salt Spray:  Max resistance 28 milliohm
Contact Resistance after Salt Spray: 70 mv max @ 1 amps
Mating/Unmating force after Salt Spray: Forces not to exceed 7 oz/contact
Contact Retention after Salt Spray: Minimum of 2 lbs contact retention
Thermal Vacuum Out gassing: NASA SP-R-0022 **
Solder Heat & Contact 360 ° C for 10 sec. & contacts must withstand
Retention: 5 lbs retention force
Solder ability: Per EIA-364, procedure 56

 

* Tested and passed while monitoring for open circuits greater than 100 nanoseconds.
** NASA requirement
Requirements in BOLD exceed the 32139 requirements