Low Profile Micro-D Discrete Wired (WD)

Low profile Micro-D micro-miniature connector series offers proven military spec performance and reliability with a reduced flange height and weight compared to standard Micro-D connectors.  These connectors meet or exceed the performance requirement of MIL-DTL-83513 and are intended for high reliability board to wire I/O and wire-to-wire applications including high-temperature applications.  The Low profile Micro-D connectors are available with 9 to 37 contacts and come with a variety of termination, hardware, and wiring options.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Dielectric Withstand Voltage: 600 VAC RMS @ sea level
Contact Resistance: 26 milliohms max (65 mV drop) @ 2.5 AMPS
Current Rating: 3 AMPS per contact
Durability: >2,000 Mating Cycles min
Insulation Resistance: 5000 Meg ohms @ 500 VDC
Shock 50 g's with no discontinuities > 1 microsecond
Vibration 20 g's with no discontinuities > 1 microsecond
Thermal Vacuum Outgassing 1.0% max TML, 0.03% CVCM - NASA SP-R-0022
Mating/Unmating Force: 3 oz (85 g) typical per contact
Material Specifications: 
Contact: Copper Alloy per MIL-DTL-83513
Contact Finish: Gold per ASTM B488, Type II, Class 1.27, Code C Over Nickel Underplate
Insulator: Thermoplastic per MIL-DTL-83513
Interfacial Seal: Fluorosilicone Elastomer per A-A-59588
Hardware: Stainless Steel, 300 Series, Passivated per SAE AMS-2700
Shell Options:
Aluminum Shell, Electroless Nickel Plated: Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221
Nickel per SAE AMS-2404
Aluminum Shell, Cadmium Plated: Alloy 6061 per SAE AMS-QQ-A-200/8, Cadmium with Yellow Chromate Conversion per SAE-AMS-QQ-P-416, Type II, Class 3 Over Nickel Underplate
Aluminum Shell, Black Anodized: Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221
Black Anodize per MIL-A-8625, Type II, Class 2
Stainless Steel Shell, Passivated: 300 Series, Passivated per SAE AMS-2700

 

 

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Low Profile Micro-D Right Angle Thru-Hole at .100" centers (H1)

Low profile Micro-D micro-miniature connector series offers proven military spec performance and reliability with a reduced flange height and weight compared to standard Micro-D connectors.  These connectors meet or exceed the performance requirement of MIL-DTL-83513 and are intended for high reliability board to wire I/O and wire-to-wire applications including high-temperature applications.  The Low profile Micro-D connectors are available with 9 to 37 contacts and come with a variety of termination, hardware, and wiring options.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Dielectric Withstand Voltage: 600 VAC RMS @ sea level
Contact Resistance: 26 milliohms max (65 mV drop) @ 2.5 AMPS
Current Rating: 3 AMPS per contact
Durability: >2,000 Mating Cycles min
Insulation Resistance: 5000 Meg ohms @ 500 VDC
Shock 50 g's with no discontinuities > 1 microsecond
Vibration 20 g's with no discontinuities > 1 microsecond
Thermal Vacuum Outgassing 1.0% max TML, 0.03% CVCM - NASA SP-R-0022
Mating/Unmating Force: 3 oz (85 g) typical per contact
Material Specifications: 
Contact: Copper Alloy per MIL-DTL-83513
Contact Finish: Gold per ASTM B488, Type II, Class 1.27, Code C Over Nickel Underplate
Insulator: Thermoplastic per MIL-DTL-83513
Interfacial Seal: Fluorosilicone Elastomer per A-A-59588
Hardware: Stainless Steel, 300 Series, Passivated per SAE AMS-2700
Shell Options:
Aluminum Shell, Electroless Nickel Plated: Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221
Nickel per SAE AMS-2404
Aluminum Shell, Cadmium Plated: Alloy 6061 per SAE AMS-QQ-A-200/8, Cadmium with Yellow Chromate Conversion per SAE-AMS-QQ-P-416, Type II, Class 3 Over Nickel Underplate
Aluminum Shell, Black Anodized: Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221
Black Anodize per MIL-A-8625, Type II, Class 2
Stainless Steel Shell, Passivated: 300 Series, Passivated per SAE AMS-2700

 

 

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Low Profile Micro-D Right Angle Thru-Hole (R2)

Low profile Micro-D micro-miniature connector series offers proven military spec performance and reliability with a reduced flange height and weight compared to standard Micro-D connectors.  These connectors meet or exceed the performance requirement of MIL-DTL-83513 and are intended for high reliability board to wire I/O and wire-to-wire applications including high-temperature applications.  The Low profile Micro-D connectors are available with 9 to 37 contacts and come with a variety of termination, hardware, and wiring options.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Dielectric Withstand Voltage: 600 VAC RMS @ sea level
Contact Resistance: 26 milliohms max (65 mV drop) @ 2.5 AMPS
Current Rating: 3 AMPS per contact
Durability: >2,000 Mating Cycles min
Insulation Resistance: 5000 Meg ohms @ 500 VDC
Shock 50 g's with no discontinuities > 1 microsecond
Vibration 20 g's with no discontinuities > 1 microsecond
Thermal Vacuum Outgassing 1.0% max TML, 0.03% CVCM - NASA SP-R-0022
Mating/Unmating Force: 3 oz (85 g) typical per contact
Material Specifications: 
Contact: Copper Alloy per MIL-DTL-83513
Contact Finish: Gold per ASTM B488, Type II, Class 1.27, Code C Over Nickel Underplate
Insulator: Thermoplastic per MIL-DTL-83513
Interfacial Seal: Fluorosilicone Elastomer per A-A-59588
Hardware: Stainless Steel, 300 Series, Passivated per SAE AMS-2700
Shell Options:
Aluminum Shell, Electroless Nickel Plated: Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221
Nickel per SAE AMS-2404
Aluminum Shell, Cadmium Plated: Alloy 6061 per SAE AMS-QQ-A-200/8, Cadmium with Yellow Chromate Conversion per SAE-AMS-QQ-P-416, Type II, Class 3 Over Nickel Underplate
Aluminum Shell, Black Anodized: Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221
Black Anodize per MIL-A-8625, Type II, Class 2
Stainless Steel Shell, Passivated: 300 Series, Passivated per SAE AMS-2700

 

 

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Low Profile Micro-D Solder Cup (SS)

Low profile Micro-D micro-miniature connector series offers proven military spec performance and reliability with a reduced flange height and weight compared to standard Micro-D connectors.  These connectors meet or exceed the performance requirement of MIL-DTL-83513 and are intended for high reliability board to wire I/O and wire-to-wire applications including high-temperature applications.  The Low profile Micro-D connectors are available with 9 to 37 contacts and come with a variety of termination, hardware, and wiring options.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Dielectric Withstand Voltage: 600 VAC RMS @ sea level
Contact Resistance: 26 milliohms max (65 mV drop) @ 2.5 AMPS
Current Rating: 3 AMPS per contact
Durability: >2,000 Mating Cycles min
Insulation Resistance: 5000 Meg ohms @ 500 VDC
Shock 50 g's with no discontinuities > 1 microsecond
Vibration 20 g's with no discontinuities > 1 microsecond
Thermal Vacuum Outgassing 1.0% max TML, 0.03% CVCM - NASA SP-R-0022
Mating/Unmating Force: 3 oz (85 g) typical per contact
Material Specifications: 
Contact: Copper Alloy per MIL-DTL-83513
Contact Finish: Gold per ASTM B488, Type II, Class 1.27, Code C Over Nickel Underplate
Insulator: Thermoplastic per MIL-DTL-83513
Interfacial Seal: Fluorosilicone Elastomer per A-A-59588
Hardware: Stainless Steel, 300 Series, Passivated per SAE AMS-2700
Shell Options:
Aluminum Shell, Electroless Nickel Plated: Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221
Nickel per SAE AMS-2404
Aluminum Shell, Cadmium Plated: Alloy 6061 per SAE AMS-QQ-A-200/8, Cadmium with Yellow Chromate Conversion per SAE-AMS-QQ-P-416, Type II, Class 3 Over Nickel Underplate
Aluminum Shell, Black Anodized: Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221
Black Anodize per MIL-A-8625, Type II, Class 2
Stainless Steel Shell, Passivated: 300 Series, Passivated per SAE AMS-2700

 

 

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Low Profile Micro-D Straight Thru-Hole (S2)

Low profile Micro-D micro-miniature connector series offers proven military spec performance and reliability with a reduced flange height and weight compared to standard Micro-D connectors.  These connectors meet or exceed the performance requirement of MIL-DTL-83513 and are intended for high reliability board to wire I/O and wire-to-wire applications including high-temperature applications.  The Low profile Micro-D connectors are available with 9 to 37 contacts and come with a variety of termination, hardware, and wiring options.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Dielectric Withstand Voltage: 600 VAC RMS @ sea level
Contact Resistance: 26 milliohms max (65 mV drop) @ 2.5 AMPS
Current Rating: 3 AMPS per contact
Durability: >2,000 Mating Cycles min
Insulation Resistance: 5000 Meg ohms @ 500 VDC
Shock 50 g's with no discontinuities > 1 microsecond
Vibration 20 g's with no discontinuities > 1 microsecond
Thermal Vacuum Outgassing 1.0% max TML, 0.03% CVCM - NASA SP-R-0022
Mating/Unmating Force: 3 oz (85 g) typical per contact
Material Specifications: 
Contact: Copper Alloy per MIL-DTL-83513
Contact Finish: Gold per ASTM B488, Type II, Class 1.27, Code C Over Nickel Underplate
Insulator: Thermoplastic per MIL-DTL-83513
Interfacial Seal: Fluorosilicone Elastomer per A-A-59588
Hardware: Stainless Steel, 300 Series, Passivated per SAE AMS-2700
Shell Options:
Aluminum Shell, Electroless Nickel Plated: Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221
Nickel per SAE AMS-2404
Aluminum Shell, Cadmium Plated: Alloy 6061 per SAE AMS-QQ-A-200/8, Cadmium with Yellow Chromate Conversion per SAE-AMS-QQ-P-416, Type II, Class 3 Over Nickel Underplate
Aluminum Shell, Black Anodized: Alloy 6061 per SAE AMS-QQ-A-200/8 or ASTMB221
Black Anodize per MIL-A-8625, Type II, Class 2
Stainless Steel Shell, Passivated: 300 Series, Passivated per SAE AMS-2700

 

 

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