Dual Row Horizontal SMT - Type AA

Dual Row Horizontal Nano Strip connectors offer an extremely low profile package that is well suited for pick and place methods. They have a very tight pitch of .025” (.64 mm) centerlines. These connectors feature Omnetics' highly reliable gold plated Flex Pin contact system, conforming to the requirements of MIL-DTL-32139. These durable lightweight connectors are perfect for the most demanding applications. These connectors are available in standard sizes ranging from 2 to 48 positions, as well as custom configurations.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Cycles
Insulation Resistance: 5,000 Megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 G’s discontinuity < 10 nanoseconds  
Vibration: 20 G’s discontinuity < 10 nanoseconds
Thermal Vacuum Outgassing    NASA SP-R-0022
Contact Resistance: 71 milliohms max (71 mV max @ 1 amp)
Current Rating: 3 amp per contact
Mating/Unmating Force: Forces not to exceed 7 oz/contact
Material Specifications
Insulator LCP per MIL-M-24519
Socket Gold Plated Copper Alloy
Encapsulant Epoxy
Standard Pin PCB Tail Termination:  Solder per J-STD-006 (Non-RoHS)
RoHS Pin PCB Tail Termination: Hard gold plate per ASTM B488
RoHS Socket PCB Tail Termination:  Hard gold plate per ASTM B488

 

 

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Tested to and passed the following performance specifications of MIL-DTL-32139

Dielectric Withstanding Voltage  250 VAC initial, 100 VAC after Humidity
Insulation Resistance: 5000 megohms min @ 100 VDC
Contact Resistance 71 mv @ 1 amp
Mating/Unmating Force Forces not to exceed 7 oz/contact
Temperature Cycling -55ºC to +125ºC, 5 Cycles
Humidity Mated    Per EIA-364, procedure 31-B, except omit steps 7A & 7B
Vibration 20 g's - no discontinuity greater than 10 nanoseconds*
Mechanical Shock: 100 g's - no discontinuity greater than 10 nanoseconds*
Durability 200 cycles
Contact Resistance after Durability 71 mv max @ 1 amp
Mating/Unmating after Durability: Forces not to exceed 7 oz/contact
Salt Spray: Per EIA-364, procedure 26-B
Low Level Contact Resistance after Salt Spray: Max resistance 28 milliohms
Contact Resistance after Salt Spray: 70 mv max @ 1 amps
Mating/Unmating force after Salt Spray: Forces not to exceed 7 oz/contact
Contact Retention after Salt Spray: Minimum of 2 lbs contact retention
Thermal Vacuum Out gassing: NASA SP-R-0022 **
Solder Heat & Contact 360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention: 5 lbs retention force
Solder ability: Per EIA-364, procedure 56

 

* Tested and passed while monitoring for open circuits greater than 100 nanoseconds
** NASA requirement Requirements in Blue exceed the 32139 requirements

Dual Row Pre-Wired - WD

Pre-wired Dual Row Nano Strip connectors are crimped using proprietary semi-automated crimping systems. Due to their small size and precision required to make these quality crimps, hand crimping is not an option. Pre-crimped wires and contacts are potted in place further protecting the integrity of the crimp joint. These connectors are available in standard sizes ranging from 2 through 48 positions as well as custom configurations, and accept wires 32 AWG or smaller stranded wire. Building these parts to order allows for maximum flexibility in wire type, size and color coding. Commercial Off The Shelf (COTS) versions are also available with 18” of color coded 30 AWG Teflon wire for quick turn around. These connectors are available in standard sizes ranging from 2 through 48 positions as well as custom configurations, and accept 30 AWG or smaller stranded wire.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Cycles
Insulation Resistance: 5,000 Megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 G’s discontinuity < 10 nanoseconds  
Vibration: 20 G’s discontinuity < 10 nanoseconds
Thermal Vacuum Outgassing    NASA SP-R-0022
Contact Resistance: 71 milliohms max (71 mV max @ 1 amp)
Current Rating: 3 amp per contact
Mating/Unmating Force: Forces not to exceed 7 oz/contact
Material Specifications
Insulator LCP per MIL-M-24519
Socket Gold Plated Copper Alloy
Encapsulant Epoxy
Standard Pin PCB Tail Termination:  Solder per J-STD-006 (Non-RoHS)
RoHS Pin PCB Tail Termination: Hard gold plate per ASTM B488
RoHS Socket PCB Tail Termination:  Hard gold plate per ASTM B488

 

 

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Tested to and passed the following performance specifications of MIL-DTL-32139

Dielectric Withstanding Voltage  250 VAC initial, 100 VAC after Humidity
Insulation Resistance: 5000 megohms min @ 100 VDC
Contact Resistance 71 mv @ 1 amp
Mating/Unmating Force Forces not to exceed 7 oz/contact
Temperature Cycling -55ºC to +125ºC, 5 Cycles
Humidity Mated    Per EIA-364, procedure 31-B, except omit steps 7A & 7B
Vibration 20 g's - no discontinuity greater than 10 nanoseconds*
Mechanical Shock: 100 g's - no discontinuity greater than 10 nanoseconds*
Durability 200 cycles
Contact Resistance after Durability 71 mv max @ 1 amp
Mating/Unmating after Durability: Forces not to exceed 7 oz/contact
Salt Spray: Per EIA-364, procedure 26-B
Low Level Contact Resistance after Salt Spray: Max resistance 28 milliohms
Contact Resistance after Salt Spray: 70 mv max @ 1 amps
Mating/Unmating force after Salt Spray: Forces not to exceed 7 oz/contact
Contact Retention after Salt Spray: Minimum of 2 lbs contact retention
Thermal Vacuum Out gassing: NASA SP-R-0022 **
Solder Heat & Contact 360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention: 5 lbs retention force
Solder ability: Per EIA-364, procedure 56

 

* Tested and passed while monitoring for open circuits greater than 100 nanoseconds
** NASA requirement Requirements in Blue exceed the 32139 requirements

Dual Row Vertical SMT - Type VV

Vertical SMT Nano Strip connectors require a minimal amount of board space on flex circuits and rigid circuit boards. These connectors feature Omnetics' highly reliable gold plated Flex Pin contact system conforming to the requirements of MIL-DTL-32139. These rugged lightweight connectors are suitable for the most demanding applications. These connectors are available in standard sizes ranging from 2 to 48 positions, as well as custom configurations.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Cycles
Insulation Resistance: 5,000 Megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 G’s discontinuity < 10 nanoseconds  
Vibration: 20 G’s discontinuity < 10 nanoseconds
Thermal Vacuum Outgassing    NASA SP-R-0022
Contact Resistance: 71 milliohms max (71 mV max @ 1 amp)
Current Rating: 3 amp per contact
Mating/Unmating Force: Forces not to exceed 7 oz/contact
Material Specifications
Insulator LCP per MIL-M-24519
Socket Gold Plated Copper Alloy
Encapsulant Epoxy
Standard Pin PCB Tail Termination:  Solder per J-STD-006 (Non-RoHS)
RoHS Pin PCB Tail Termination: Hard gold plate per ASTM B488
RoHS Socket PCB Tail Termination:  Hard gold plate per ASTM B488

 

 

This PDF requires the free Adobe Reader.

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Tested to and passed the following performance specifications of MIL-DTL-32139

Dielectric Withstanding Voltage  250 VAC initial, 100 VAC after Humidity
Insulation Resistance: 5000 megohms min @ 100 VDC
Contact Resistance 71 mv @ 1 amp
Mating/Unmating Force Forces not to exceed 7 oz/contact
Temperature Cycling -55ºC to +125ºC, 5 Cycles
Humidity Mated    Per EIA-364, procedure 31-B, except omit steps 7A & 7B
Vibration 20 g's - no discontinuity greater than 10 nanoseconds*
Mechanical Shock: 100 g's - no discontinuity greater than 10 nanoseconds*
Durability 200 cycles
Contact Resistance after Durability 71 mv max @ 1 amp
Mating/Unmating after Durability: Forces not to exceed 7 oz/contact
Salt Spray: Per EIA-364, procedure 26-B
Low Level Contact Resistance after Salt Spray: Max resistance 28 milliohms
Contact Resistance after Salt Spray: 70 mv max @ 1 amps
Mating/Unmating force after Salt Spray: Forces not to exceed 7 oz/contact
Contact Retention after Salt Spray: Minimum of 2 lbs contact retention
Thermal Vacuum Out gassing: NASA SP-R-0022 **
Solder Heat & Contact 360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention: 5 lbs retention force
Solder ability: Per EIA-364, procedure 56

 

* Tested and passed while monitoring for open circuits greater than 100 nanoseconds
** NASA requirement Requirements in Blue exceed the 32139 requirements

Dual Row Flex Tail - Type FF

Flex Mount Nano Strip connectors are a low profile ruggedized connector on .025” (.64 mm) centerlines. The flex tails are formed together in an hourglass shape, allowing a double sided flex circuit to slide between the 2 rows. The spring tension holds the flex in place during the soldering process. These connectors feature Omnetics' highly reliable gold plated Flex Pin contact system conforming to the requirements of MIL-DTL-32139. These durable lightweight connectors are suitable for the most demanding applications. These connectors are available in standard sizes ranging from 2 through 48 positions as well as custom configurations. Flex design and installation service is also available from Omnetics. Please contact us for more information.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Cycles
Insulation Resistance: 5,000 Megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 G’s discontinuity < 10 nanoseconds  
Vibration: 20 G’s discontinuity < 10 nanoseconds
Thermal Vacuum Outgassing    NASA SP-R-0022
Contact Resistance: 71 milliohms max (71 mV max @ 1 amp)
Current Rating: 3 amp per contact
Mating/Unmating Force: Forces not to exceed 7 oz/contact
Material Specifications
Insulator LCP per MIL-M-24519
Socket Gold Plated Copper Alloy
Encapsulant Epoxy
Standard Pin PCB Tail Termination:  Solder per J-STD-006 (Non-RoHS)
RoHS Pin PCB Tail Termination: Hard gold plate per ASTM B488
RoHS Socket PCB Tail Termination:  Hard gold plate per ASTM B488

 

 

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Tested to and passed the following performance specifications of MIL-DTL-32139

Dielectric Withstanding Voltage  250 VAC initial, 100 VAC after Humidity
Insulation Resistance: 5000 megohms min @ 100 VDC
Contact Resistance 71 mv @ 1 amp
Mating/Unmating Force Forces not to exceed 7 oz/contact
Temperature Cycling -55ºC to +125ºC, 5 Cycles
Humidity Mated    Per EIA-364, procedure 31-B, except omit steps 7A & 7B
Vibration 20 g's - no discontinuity greater than 10 nanoseconds*
Mechanical Shock: 100 g's - no discontinuity greater than 10 nanoseconds*
Durability 200 cycles
Contact Resistance after Durability 71 mv max @ 1 amp
Mating/Unmating after Durability: Forces not to exceed 7 oz/contact
Salt Spray: Per EIA-364, procedure 26-B
Low Level Contact Resistance after Salt Spray: Max resistance 28 milliohms
Contact Resistance after Salt Spray: 70 mv max @ 1 amps
Mating/Unmating force after Salt Spray: Forces not to exceed 7 oz/contact
Contact Retention after Salt Spray: Minimum of 2 lbs contact retention
Thermal Vacuum Out gassing: NASA SP-R-0022 **
Solder Heat & Contact 360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention: 5 lbs retention force
Solder ability: Per EIA-364, procedure 56

 

* Tested and passed while monitoring for open circuits greater than 100 nanoseconds
** NASA requirement Requirements in Blue exceed the 32139 requirements

Dual Row Straight Tail - Type DD

The Dual Row Nano Strip connectors are configured with simple straight tails (Integral and Crimped). Suitable for vertical thru-hole mounting to fine pitched flex circuits. These ruggedized nano connectors are designed on .025” (.64 mm) centerlines. The straight tails are commonly used in a variety of wrap termination such as neuroscience related applications. Whatever your application, these connectors feature Omnetics' gold plated Flex Pin contact system that conforms to the requirements of MIL-DTL-32139. These connectors are available in standard sizes ranging from 2 through 48 positions as well as custom configurations. Flex design and installation service is also available from Omnetics. Please contact us for more information.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Cycles
Insulation Resistance: 5,000 Megohms min @ 100 VDC
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 G’s discontinuity < 10 nanoseconds  
Vibration: 20 G’s discontinuity < 10 nanoseconds
Thermal Vacuum Outgassing    NASA SP-R-0022
Contact Resistance: 71 milliohms max (71 mV max @ 1 amp)
Current Rating: 3 amp per contact
Mating/Unmating Force: Forces not to exceed 7 oz/contact
Material Specifications
Insulator LCP per MIL-M-24519
Socket Gold Plated Copper Alloy
Encapsulant Epoxy
Standard Pin PCB Tail Termination:  Solder per J-STD-006 (Non-RoHS)
RoHS Pin PCB Tail Termination: Hard gold plate per ASTM B488
RoHS Socket PCB Tail Termination:  Hard gold plate per ASTM B488

 

 

This PDF requires the free Adobe Reader.

Click here to dowload the Adobe Reader

This PDF requires the free Adobe Reader.

Click here to dowload the Adobe Reader

Tested to and passed the following performance specifications of MIL-DTL-32139

Dielectric Withstanding Voltage  250 VAC initial, 100 VAC after Humidity
Insulation Resistance: 5000 megohms min @ 100 VDC
Contact Resistance 71 mv @ 1 amp
Mating/Unmating Force Forces not to exceed 7 oz/contact
Temperature Cycling -55ºC to +125ºC, 5 Cycles
Humidity Mated    Per EIA-364, procedure 31-B, except omit steps 7A & 7B
Vibration 20 g's - no discontinuity greater than 10 nanoseconds*
Mechanical Shock: 100 g's - no discontinuity greater than 10 nanoseconds*
Durability 200 cycles
Contact Resistance after Durability 71 mv max @ 1 amp
Mating/Unmating after Durability: Forces not to exceed 7 oz/contact
Salt Spray: Per EIA-364, procedure 26-B
Low Level Contact Resistance after Salt Spray: Max resistance 28 milliohms
Contact Resistance after Salt Spray: 70 mv max @ 1 amps
Mating/Unmating force after Salt Spray: Forces not to exceed 7 oz/contact
Contact Retention after Salt Spray: Minimum of 2 lbs contact retention
Thermal Vacuum Out gassing: NASA SP-R-0022 **
Solder Heat & Contact 360 ° C for 10 sec. & contacts must withstand 5 lbs retention force
Retention: 5 lbs retention force
Solder ability: Per EIA-364, procedure 56

 

* Tested and passed while monitoring for open circuits greater than 100 nanoseconds
** NASA requirement Requirements in Blue exceed the 32139 requirements

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