Nano-D / Bi-Lobe® Connectors - Dual Row - Horizontal SMT (AA)

Horizontal SMT Bi-Lobe® nanos offer an extremely low profile package that is well suited to pick and place mounting methods. These connectors feature Omnetics highly reliable gold plated Flex Pin contact system conforms to the requirements of MIL-DTL-32139. These rugged lightweight connectors are suitable for the most demanding applications. Available with threaded mounting holes suitable for PCB and flex mounting. These connectors are available in standard sizes ranging from 9 through 65 positions, as well as custom configurations.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5000 megohms min
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s discontinuties > 10 nanosecond     
Vibration: 20 g’s discontinuties > 10 nanosecond     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 amp
Current Rating: 1 amp per contact
Mating/Unmating Force: 7oz. (198g) max per contact
Material Specifications
Shell Material and Finish Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator Liquid Crystal Polymer                
Pin Gold Plated BeCu
Insulator LCP per MIL-DTL-83513 or PEEK
Socket Gold Plated Copper Alloy
Encapsulant Epoxy

 

 

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Dual Row Connector Savers

Omnetics Bi-Lobe® connectors are rated for 200+ mating cycles, however, many applications carry their own restrictions as to how many times a connector may be mated and unmated during programming, test and burn-in.

To support these requirements, Omnetics offers a "Connector Saver" which can be mated to the corresponding connector on the sensitive equipment. They utilize the same rugged and reliable Flex Pin contact system. Spaced on 25 mil (.64mm) centerlines, they are capable of carrying 1 amp per contact.

Bi-Lobe® "Connector Savers" are available in pin counts from 9-65

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5000 megohms min
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s discontinuties > 10 nanosecond     
Vibration: 20 g’s discontinuties > 10 nanosecond     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 amp
Current Rating: 1 amp per contact
Mating/Unmating Force: 7oz. (198g) max per contact
Material Specifications
Shell Material and Finish Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator Liquid Crystal Polymer                
Pin Gold Plated BeCu
Insulator LCP per MIL-DTL-83513 or PEEK
Socket Gold Plated Copper Alloy
Encapsulant Epoxy

 

 

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Nano-D / Bi-Lobe® Connectors - Dual Row -Vertical SMT (VV)

Vertical SMT Bi-Lobe® nanos reqiure a minimal amount of board space on flex circuits and rigid circuit boards. These connector feature Omnetics' highly reliable gold plated Flex Pin contact system conforms to the requirements of MIL-DTL-32139.These rugged lightweight connectors are suitable for the most demanding applications. They are available with threaded mounting holes and retention screws.

Shell material choices include Titanium, Aluminum and Stainless Steel with multiple standard and custom plating options upon request. These connectors are available in standard sizes ranging from 9 through 65 positions, as well as custom configurations.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5000 megohms min
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s discontinuties > 10 nanosecond     
Vibration: 20 g’s discontinuties > 10 nanosecond     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 amp
Current Rating: 1 amp per contact
Mating/Unmating Force: 7oz. (198g) max per contact
Material Specifications
Shell Material and Finish Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator Liquid Crystal Polymer                
Pin Gold Plated BeCu
Insulator LCP per MIL-DTL-83513 or PEEK
Socket Gold Plated Copper Alloy
Encapsulant Epoxy

 

 

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Nano-D / Bi-Lobe® Connectors - Dual Row - Straight Tail (DD)

The Dual Row Bi-Lobe® nanos are configured with simple straight tails (Integral Or Crimped). Suitable for vertical through hole mounting to fine pitched flex circuits. These ruggedized nano connectors are designed on .25" (.64mm) centerlines.

The Straight solid tails are commonly used in ultra fine wire wrap termination, such as used in electro-physiology. Whatever your application, these connectors feature Omnetics' gold plated Flex Pin contact system conforms to the requirements of MIL-DTL-32139.

They are available with retension screws for a positive lock. These connectors are available in standard sizes ranging from 9 thorugh 65 positions, as well as custom configurations.

Flex design and installation service is also available from Omnetics. Please contact us for more information.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5000 megohms min
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s discontinuties > 10 nanosecond     
Vibration: 20 g’s discontinuties > 10 nanosecond     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 amp
Current Rating: 1 amp per contact
Mating/Unmating Force: 7oz. (198g) max per contact
Material Specifications
Shell Material and Finish Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator Liquid Crystal Polymer                
Pin Gold Plated BeCu
Insulator LCP per MIL-DTL-83513 or PEEK
Socket Gold Plated Copper Alloy
Encapsulant Epoxy

 

 

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Nano-D / Bi-Lobe® Connectors - Dual Row - Thru-Hole Horizontal (H4)

The Dual Row Bi-Lobe® H4 nanos are a thru-hole mounted, low mass ruggedized connector on .025” (.64 mm) centerlines. The thru-hole tails are spread into a mounting pattern on .050” (1.27 mm) centers, allowing space for annular rings and routing traces.

They feature Omnetics’ gold plated Flex Pin contact system conforming to the requirements of MIL-DTL -32139. These durable lightweight connectors are perfect for the most demanding applications and are intermateable with Omnetics’ QPL versions of Military Specification MIL-DTL-32139.

They are available with retention screws for a positive lock. These connectors are available in standard sizes ranging from 9 through 65 positions, as well as custom configurations.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5000 megohms min
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s discontinuties > 10 nanosecond     
Vibration: 20 g’s discontinuties > 10 nanosecond     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 amp
Current Rating: 1 amp per contact
Mating/Unmating Force: 7oz. (198g) max per contact
Material Specifications
Shell Material and Finish Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator Liquid Crystal Polymer                
Pin Gold Plated BeCu
Insulator LCP per MIL-DTL-83513 or PEEK
Socket Gold Plated Copper Alloy
Encapsulant Epoxy

 

 

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Nano-D / Bi-Lobe® Connectors - Dual Row -Thru-Hole Vertical (V4)

The Dual Row Nano-D / Bi-Lobe® V4 offers a low mass vertical thru-hole mounted orientation, making it ideal for high shock & vibration environments. These ruggedized nanos have contacts arranged on .025" (.64 mm) center lines. The tails are spread into a mounting pattern on .050” (1.27 mm) centers, allowing space for the routing of traces and size of annular rings.

These connectors feature Omnetics’ highly dependable gold plated Flex Pin contact system conforming to the requirements of MIL-DTL-32139. These durable lightweight connectors are perfect for the most demanding applications and are intermateable with Omnetics’ QPL versions of Military Specification MIL-DTL-32139.

They are available with retention screws for a positive lock. These connectors are available in standard sizes ranging from 9 through 65 positions, as well as custom configuration

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5000 megohms min
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s discontinuties > 10 nanosecond     
Vibration: 20 g’s discontinuties > 10 nanosecond     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 amp
Current Rating: 1 amp per contact
Mating/Unmating Force: 7oz. (198g) max per contact
Material Specifications
Shell Material and Finish Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator Liquid Crystal Polymer                
Pin Gold Plated BeCu
Insulator LCP per MIL-DTL-83513 or PEEK
Socket Gold Plated Copper Alloy
Encapsulant Epoxy

 

 

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Nano-D / Bi-Lobe® Connectors - Dual Row - Flex Mount (FF)

Flex Mount Bi-Lobe® nanos are a low profile ruggedized connector on .025” (.64 mm) centerlines. The SMT tails are formed together in an hourglass shape, allowing a double sided flex circuit to slide between the 2 rows. The spring tension holds the flex in place during the soldering process.

These connectors feature Omnetics’ highly reliable gold plated Flex Pin contact system conforming to the requirements of MIL-DTL-32139. These durable lightweight connectors are suitable for the most demanding applications. These connectors are available in standard sizes ranging from 9 through 65 positions, as well as custom configurations.

Flex design and installation service is also available from Omnetics. Please contact us for more information.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5000 megohms min
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s discontinuties > 10 nanosecond     
Vibration: 20 g’s discontinuties > 10 nanosecond     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 amp
Current Rating: 1 amp per contact
Mating/Unmating Force: 7oz. (198g) max per contact
Material Specifications
Shell Material and Finish Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator Liquid Crystal Polymer                
Pin Gold Plated BeCu
Insulator LCP per MIL-DTL-83513 or PEEK
Socket Gold Plated Copper Alloy
Encapsulant Epoxy

 

 

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Nano-D / Bi-Lobe® Connectors - Dual Row - Pre-Wired (WD)

Pre-Wired Dual Row Bi-Lobe® nanos are available with 30 AWG and smaller stranded wire. These assemblies are crimped using proprietary semi-automated crimping systems. Due to their small size and precision required to make these quality crimps, hand crimping is not an option. Precrimped wires and contacts are potted in place further protecting the integrity of the crimp joint.

Building these parts to order allows for maximum flexibility in wire type, size and color coding. Commercial off the shelf (COTS) versions are also available with 18” of color coded 30 AWG Teflon for quick turn around.

These connectors are available in standard sizes ranging from 9 through 65 positions, as well as custom configurations. Full QPL versions of MIL-DTL -32139 are also available from Omnetics.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5000 megohms min
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s discontinuties > 10 nanosecond     
Vibration: 20 g’s discontinuties > 10 nanosecond     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 amp
Current Rating: 1 amp per contact
Mating/Unmating Force: 7oz. (198g) max per contact
Material Specifications
Shell Material and Finish Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator Liquid Crystal Polymer                
Pin Gold Plated BeCu
Insulator LCP per MIL-DTL-83513 or PEEK
Socket Gold Plated Copper Alloy
Encapsulant Epoxy

 

 

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Nano-D / Bi-Lobe® Connectors - Dual Row - Jumpers (JU)

Pre-Wired Dual Row Bi-Lobe® nanos are available with 30 AWG and smaller stranded wire. These assemblies are crimped using proprietary semi-automated crimping systems. Due to their small size and precision required to make these quality crimps, hand crimping is not an option. Precrimped wires and contacts are potted in place further protecting the integrity of the crimp joint.

Building these parts to order allows for maximum flexibility in wire type, size and color coding. Commercial off the shelf (COTS) versions are also available with 18” of color coded 30 AWG Teflon for quick turn around.

These connectors are available in standard sizes ranging from 9 through 65 positions, as well as custom configurations. Full QPL versions of MIL-DTL -32139 are also available from Omnetics.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5000 megohms min
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s discontinuties > 10 nanosecond     
Vibration: 20 g’s discontinuties > 10 nanosecond     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 amp
Current Rating: 1 amp per contact
Mating/Unmating Force: 7oz. (198g) max per contact
Material Specifications
Shell Material and Finish Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator Liquid Crystal Polymer                
Pin Gold Plated BeCu
Insulator LCP per MIL-DTL-83513 or PEEK
Socket Gold Plated Copper Alloy
Encapsulant Epoxy

 

 

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Nano-D / Bi-Lobe® Dual Row MIL-DTL-32139 QPL

Pre-Wired Dual Row Bi-Lobe® nanos can be ordered with full QPL approval. These assemblies are crimped using proprietary automated crimping systems in Omnetics MIL-STD-790 approved manufacturing facility pre-crimped wires & contacts are potted in place further protecting the integrity of the crimp joint.

Building these as full QPL parts gives users an added level of confidence of critical applications.

Commercial off the shelf(COTS) non-QPL versions are also available with 18" of color coded 30 AWG Teflon for quick turn aroiund.

These connectors are available in standard sizes ranging from 9 through 65 positions.

Electrical Mechanical Specifications
Temperature: -55ºC to 125ºC (200ºC with HTE)
Durability:     200 Mating cycles min*
Insulation Resistance: 5000 megohms min
Voltage Rating (DWV) 250 VAC RMS Sea Level
Shock: 100 g’s discontinuties > 10 nanosecond     
Vibration: 20 g’s discontinuties > 10 nanosecond     
Thermal Vacuum Outgassing    1.0% max TML, 0.1% max VCM
Contact Resistance: 71 mV Drop @ 1 amp
Current Rating: 1 amp per contact
Mating/Unmating Force: 7oz. (198g) max per contact
Material Specifications
Shell Material and Finish Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated
Insulator Liquid Crystal Polymer                
Pin Gold Plated BeCu
Insulator LCP per MIL-DTL-83513 or PEEK
Socket Gold Plated Copper Alloy
Encapsulant Epoxy

 

 

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Tested to and passed the following performance specifications of MIL-DTL-32139

Dielectric Withstanding Voltage  250 VAC initial, 100 VAC after Humidity
Insulation Resistance: 5000 megohms min
Contact Resistance 71 mV max @ 1 amp
Mating/Unmating Force Forces not to exceed 7 oz/contact   
Temperature Cycling -55ºC to 125ºC, 5 Cycles
Humidity Mated    Per EIA-364, procedure 31-B, except omit steps 7A & 7B 
Vibration 20 g's - no discontinuity greater than 10 nanoseconds*
Mechanical Shock: 100 g's - no discontinuity greater than 10 nanoseconds*
Durability 200 cycles
Contact Resistance after Durability  71 mv max @ 1 amps
Mating/Unmating after Durability: Forces not to exceed 7 oz/contact      
Salt Spray: Per EIA-364, procedure 26-B
Low Level Contact Resistance after Salt Spray:  Max resistance 28 milliohm
Contact Resistance after Salt Spray: 70 mv max @ 1 amps
Mating/Unmating force after Salt Spray: Forces not to exceed 7 oz/contact
Contact Retention after Salt Spray: Minimum of 2 lbs contact retention
Thermal Vacuum Out gassing: NASA SP-R-0022 **
Solder Heat & Contact 360 ° C for 10 sec. & contacts must withstand
Retention: 5 lbs retention force
Solder ability: Per EIA-364, procedure 56

 

* Tested and passed while monitoring for open circuits greater than 100 nanoseconds.
** NASA requirement
Requirements in BOLD exceed the 32139 requirements 

Contact Customer Support (1-800-343-0025 / 763-572-0656), or find a Distributor / Representative.
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